Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-29T13:38:29.193Z Has data issue: false hasContentIssue false

Evolution of Subgrain Boundaries in Heteroepitaxial GaN/AlN/6H-SiC Grown by Metalorganic Chemical Vapor Deposition

Published online by Cambridge University Press:  11 February 2011

H. X. Liu
Affiliation:
Department of Electrical Engineering and Center for Solid State Electronics Research, Arizona State University, Tempe, AZ, 85287–5706, U.S.A.
G. N. Ali
Affiliation:
Department of Electrical Engineering and Center for Solid State Electronics Research, Arizona State University, Tempe, AZ, 85287–5706, U.S.A.
K. C. Palle
Affiliation:
Department of Electrical Engineering and Center for Solid State Electronics Research, Arizona State University, Tempe, AZ, 85287–5706, U.S.A.
M. K. Mikhov
Affiliation:
Department of Electrical Engineering and Center for Solid State Electronics Research, Arizona State University, Tempe, AZ, 85287–5706, U.S.A.
B. J. Skromme
Affiliation:
Department of Electrical Engineering and Center for Solid State Electronics Research, Arizona State University, Tempe, AZ, 85287–5706, U.S.A.
Z. J. Reitmeyer
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC, 27695–7907, U.S.A.
R. F. Davis
Affiliation:
Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC, 27695–7907, U.S.A.
Get access

Abstract

We have characterized the surface morphology and luminescence properties of GaN/AlN/ SiC layers of various thicknesses using secondary electron imaging (SEI), panchromatic room temperature cathodoluminescence (CL), atomic force microscopy (AFM), optical Nomarski microscopy, and room and low temperature photoluminescence (PL). The nominally undoped GaN layers were grown by MOCVD on 0.1 m thick AlN buffer layers on commercial 6H-SiC(0001) substrates. The GaN layer thicknesses are 0.5, 1.0, 1.6, and 2.6 m. A second 1.0 m thick layer was grown by identical procedures on a 6H-SiC substrate that was first etched in H2 to remove scratches and damage due to mechanical polishing. Biaxial compressive lattice mismatch stress is present in all layers and decreases with increasing layer thickness, while PL linewidths decrease. The 1 m layer on the H-etched substrate is as relaxed as the 2.6 m layer on a non H-etched substrate, however. Pronounced surface structures, apparently corresponding to columnar subgrain boundaries, are observed on the samples on non H-etched SiC. Their typical sizes increase from about 3 to 10 m with increasing layer thickness. They are absent in the H-etched sample. These structures are generally nonradiative in CL images, although mottled contrast is also observed inside them. Similar layers doped with 3×1018 cm−3 Si do not show these features, suggesting a different microstructure.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Morkoç, H., Strite, S., Gao, G.B., Lin, M.E., Sverdlov, B., and Burns, M., J. Appl. Phys. 76, 1363 (1994).Google Scholar
2. Strite, S., Lin, M.E., and Morkoç, H., Thin Solid Films 231, 197 (1993).Google Scholar
3. Einfeldt, S., Reitmeier, Z.J., and Davis, R.F., submitted to J. Crystal Growth.Google Scholar
4. Davis, R.F., Weeks, T.W., Bremser, M.D., Tanka, S., Kern, R.S., Sitar, Z., Ailey, K.S., Perry, W.G, and Wang, C., Mater. Res. Soc. Symp. Proc. 395, 3 (1996).Google Scholar
5. Hallin, C., Owman, F., Martensson, P., Ellison, A., Konstantinov, A., Kordina, O., and Janzen, E., J. Crystal Growth 181, 241 (1997).Google Scholar
6. Chu, T.L. and Campbell, R.B., J. Electrochem. Soc. 112, 955 (1965).Google Scholar
7. Owman, F., Hallin, C., Martensson, P., and Janzen, E., J. Crystal Growth 167, 391 (1996).Google Scholar
8. Ramachandran, V., Brady, M.F., Smith, A.R., Feenstra, R.M., and Greve, D.W., J. Electron. Mater. 27, 308 (1998).Google Scholar
9. Ruvimov, S., Liliental-Weber, Z., Suski, T., Ager, J.W. III, Washburn, J., Krueger, J., Kisielowski, C., Weber, E.R., Amano, H., and Akasaki, I., Appl. Phys. Lett. 69, 990 (1996).Google Scholar
10. Liliental-Weber, Z., Ruvimov, S., Suski, T., Ager, J.W. III, Swider, W., Chen, Y., Kisielowski, Ch., Washburn, J., Akasaki, I., Amano, H., Kuo, C., and Imler, W., Mater. Res. Soc. Symp. Proc. 423, 487 (1996).Google Scholar
11. Skromme, B.J., Palle, K.C., Poweleit, C.D., Yamane, H., Aoki, M., and DiSalvo, F.J., Appl. Phys. Lett. 81, 3765 (2002).Google Scholar
12. Perry, W.G., Zheleva, T., Bremser, M.D., Davis, R.F., Shan, W., and Song, J.J., J. Electron. Mater. 26, 224 (1997).Google Scholar