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Eutectic Bonding of Copper to Ceramics

Published online by Cambridge University Press:  22 February 2011

Marc Wittmer
Marc Wittmer*
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
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Abstract

Eutectic bonding of copper to ceramics makes use of a liquid eutectic between copper and oxygen at 1065°C which wets oxide ceramics very well. Upon solidification of the eutectic melt a very strong bond is established which has a strength of about 5×107N/m2. The excellent bond strength gives this technique important applications in electronic packaging and mechanical engineering.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 393
Copyright
Copyright © Materials Research Society 1985

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References

1. Burgess, J.F., Neugebauer, C.A. and Flanagan, G., J. Electrochem. Soc. 122, 688 (1975).Google Scholar
2. Sun, Y.E. and Driscol, J.C., IEEE, IAS Conference Record 1975, p. 50.Google Scholar
3. Sun, Y.E. and Driscol, J.C., IEEE Trans. El. Dev. ED–23, 961 (1975).Google Scholar
4. Driscol, J.C., Sun, Y.E., Cusano, D.A. and Loughran, J.A., Proc. Int. Microelectronics Symp., Oct. 11-13, 1976, Vancouver, Canada, p.96.Google Scholar
5. Chaklader, A.C.D., Armstrong, A.M. and Misra, S.K., J. Am. Ceram. Soc. 51, 630 (1968).Google Scholar
6. O'Brien, T.E. and Chaklader, A.C.D., J. Am. Ceram. Soc. 57, 329 (1974).Google Scholar
7. Misra, S.K. and Chaklader, A.C.D., J. Am. Ceram. Soc. 46, 509 (1963).Google Scholar
8. Gadalla, A.M.M. and White, J., Trans. Brit. Ceram. Soc. 63, 39 (1964).Google Scholar
9. Jacob, K.T. and Alcock, C.B., J. Am. Ceram. Soc. 58, 192 (1975).CrossRefGoogle Scholar
10. Keser, H., Schuiler, C. and Wittmer, M., DVS-Berichte, Vol.66, German Welding Soc., Dusseldorf, Germany 1980.Google Scholar
11. Hansen, M. and Anderko, K., Constitution of Binary Alloys, McGraw-Hill, New York 1958, p. 604.Google Scholar
12. Wittmer, M., Boer, C.R., Gudmundson, P., and Carlsson, J., J. Am. Ceram. Soc. 65, 149 (1982).Google Scholar