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Equal Thickness Contours of Films Deposited on Inclined Substrates by Evaporation and Ion Beam Assisted Deposition

Published online by Cambridge University Press:  21 February 2011

W. Franzen
Affiliation:
U.S. Army Research Laboratory, Materials Directorate, Watertown, MA 02172
J.D. Demaree
Affiliation:
U.S. Army Research Laboratory, Materials Directorate, Watertown, MA 02172
C.G. Fountzoulas
Affiliation:
U.S. Army Research Laboratory, Materials Directorate, Watertown, MA 02172
J.K. Hirvonen
Affiliation:
U.S. Army Research Laboratory, Materials Directorate, Watertown, MA 02172
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Abstract

A study is presented of the geometrical shape of deposition contours that arise when material is evaporated from a point source onto an inclined substrate, an arrangement common in ion-assisted deposition. The shape of the contours, as determined by the inverse square law and the angles of emission and incidence, is described by a fourth-order algebraic equation in polar coordinates on the surface of the substrate. The equation defines a family of distorted ellipses whose form depends on the angle of tilt. An experimental test of these relations by electron-beam deposition of an ion-bombarded oil film on a tilted silicon wafer will be reported.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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