Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-27T02:10:03.406Z Has data issue: false hasContentIssue false
  • English
  • Français

Electroplate-and-Lift (E&L) Lithography on Reusable, Patterned Ultrananocrystalline Diamond (UNCD) Templates for Rapid Prototyping of Micro- and Nanowires.

Published online by Cambridge University Press:  30 March 2012

Dylan Jones ,
Lori A. Lepak ,
Anirudha V. Sumant ,
Ralu Divan ,
Orlando Auciello ,
David B. Seley ,
Daniel A. Dissing ,
Suzanne Miller ,
Daniel Rosenmann  and
Ephriam Daniels
...Show all authors
Dylan Jones
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Lori A. Lepak
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Anirudha V. Sumant
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Ralu Divan
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Orlando Auciello
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL 60439, USA
David B. Seley
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Daniel A. Dissing
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Suzanne Miller
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Daniel Rosenmann
Affiliation:
Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA
Ephriam Daniels
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Ruth Gervais
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Michael P. Zach
Affiliation:
Dept. of Chemistry, University of Wisconsin – Stevens Point, Stevens Point, WI 54481, USA
Get access

Abstract

As device sizes are scaled down nearly to their atomic limits, the development of economically viable methods which may continue to improve device performance in accordance with Moore’s Law becomes ever more challenging. The recently developed technique of Electroplate-and-Lift (E&L) lithography promises to be an inexpensive, widely applicable method for the reproducible, controlled fabrication of micro- and nanostructures. In this study, E&L is applied to the fabrication of patterned copper micro- and nanowires as a model system. Copper wires with diameters ranging from 10 m to 200 nm have been produced using a single ultrananocrystalline diamond (UNCD)TM template, by varying only the electroplating time.

To quantify the relationship between copper wire diameter and deposition time, wires were electroplated at -0.4 V vs. the saturated calomel electrode (SCE) for durations between 2.5 and 160 s, then imaged by optical microscopy and/or scanning electron microscopy (SEM). Images were analyzed by identifying wire segments with ImageJ and examining the statistical distribution of wire diameters using Excel. This analysis verified theoretical predictions of a linear dependence between mean wire diameter and the square root of growth time.

Keywords

lithography (deposition)nanostructureelectrodeposition
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1412: Symposium FF – Mechanical Nanofabrication, Nanopatterning and Nanoassembly , 2012 , mrsf11-1412-ff02-05
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Seley, D.B., Dissing, D.A., Sumant, A.V., Divan, R., Miller, S., Auciello, O., Lepak, L.A., Terrell, E.A., Shogren, T.J., Fahrner, D.A., Hamilton, J.P., and Zach, M.P., ACS Applied Materials & Interfaces 3(4), 925–930 (2011)Google Scholar
[2] Zach, M., Electroplate and Lift Lithography: A New Technique for Nanomanufacturing, Nickel Wires as a Case Study, in Proceedings of 2011 NSF Engineering Research and Innovation Conference, Atlanta, Georgia.Google Scholar
[3] Menke, E. J., Brown, M. A., Li, Q., Hemminger, J. C., and Penner, R. M., Langmuir 22(25), 10564–10574 (2006)Google Scholar
[4] The exact series of deposition times for zinc/copper were as follows: 0.19s/2.5s; 0.38s/5s; 0.75s/10s; 1.5s/20s; 3s /40s; 3s/80s; and 3s/160s.Google Scholar
[5] ImageJ is available to the public for free download, at http://rsbweb.nih.gov/ij/download.html Google Scholar
[6] ImageJ identified a total of 350, 330, 988, 765, 617, 1964, and 2210 wire segments, among images of wires deposited for 2.5 s, 5 s, 10 s, 20 s, 40 s, 80 s, and 160 s, respectively.Google Scholar
[7] Data not shown. A more thorough discussion of factors affecting the liftoff step of Electroplate and Lift lithography is expected to form the basis of a future manuscript, but is beyond the scope of the present work.Google Scholar
[8] Zach, M.P., Ng, K.H., and Penner, R.M., Science 290, 2120 (2000)Google Scholar