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Electrophoretic Deposition of Single Wall Carbon Nanotube Films and Characterization

Published online by Cambridge University Press:  30 December 2014

Junyoung Lim ,
Maryam Jalali  and
Stephen A. Campbell
Junyoung Lim
Affiliation:
Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455, U.S.A.
Maryam Jalali
Affiliation:
Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455, U.S.A.
Stephen A. Campbell
Affiliation:
Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455, U.S.A.
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Abstract

Electrophoretic deposition enables the rapid deposition of single wall carbon nanotube films at room temperature. An accurate, reproducible film thickness can be obtained by controlling electric field strength, suspension concentration, and time. To investigate the electrical and mechanical properties of such films, we recorded electric resistance and Young’s modulus using I-V characterization and a nanoindenter, respectively. The measured resistivity of the films varied from 2.14 × 10-3 to 7.66 × 10-3 Ω·cm, and the Young’s modulus was 4.72 to 5.67 GPa, independent of film thickness from 77 to 134 nm. These results indicated that the mechanical and electrical properties of film are comparable with previously reported methods such as layer by layer deposition even though we achieved much higher deposition rates. We also measured the film mass density which is usually unrecorded even though it is an important parameter for MEMS/NEMS device actuation. The film density was found with conventional thickness measurement and Rutherford backscattering spectrometry. It varied from 0.12 to 0.54 g/cm3 as the film thickness increased. This method could be extended to applications of CNT films for flexible electronics or high frequency RF MEMS devices.

Keywords

Rutherford backscattering (RBS)electrochemical synthesisthin film
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1752: Symposium MM – Carbon Nanotubes—Synthesis, Properties, Functionalization, and Applications , 2014 , pp. 59 - 63
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

Jaroenapibal, P., Luzzi, D.E., Evoy, S., Nanotechnology, 2004. 4th IEEE Conference on, 2004, pp. 260–262.Google Scholar
Bellucci, S., physica status solidi (c), 2 (2005) 34–47.CrossRefGoogle Scholar
Boccaccini, A.R., Cho, J., Roether, J.A., Thomas, B.J.C., Jane Minay, E., Shaffer, M.S.P., Carbon, 44 (2006) 3149–3160.CrossRefGoogle Scholar
Boccaccini, A., Kaya, C., Shaffer, M.P., Electrophoretic Deposition of Carbon Nanotubes (CNTs) and CNT/Nanoparticle Composites, in: Dickerson, J.H., Boccaccini, A.R. (Eds.) Electrophoretic Deposition of Nanomaterials, Springer New York, 2012, pp. 157–179.CrossRefGoogle Scholar
Cho, J., Konopka, K., Rożniatowski, K., García-Lecina, E., Shaffer, M.S.P., Boccaccini, A.R., Carbon, 47 (2009) 58–67.CrossRefGoogle Scholar
Sun, Z., Nicolosi, V., Rickard, D., Bergin, S.D., Aherne, D., Coleman, J.N., The Journal of Physical Chemistry C, 112 (2008) 10692–10699.CrossRefGoogle Scholar
Wang, H., Current Opinion in Colloid & Interface Science, 14 (2009) 364–371.CrossRefGoogle Scholar
O'Connell, M.J., Bachilo, S.M., Huffman, C.B., Moore, V.C., Strano, M.S., Haroz, E.H., Rialon, K.L., Boul, P.J., Noon, W.H., Kittrell, C., Ma, J., Hauge, R.H., Weisman, R.B., Smalley, R.E., Science, 297 (2002) 593–596.CrossRefGoogle Scholar
Hamaker, H.C., Transactions of the Faraday Society, 35 (1940) 279–287.CrossRefGoogle Scholar
Fischer-Cripps, A.C., Nanoindentation, Springer, 2011.CrossRefGoogle Scholar
Wang, M., Liechti, K.M., White, J.M., Winter, R.M., Journal of the Mechanics and Physics of Solids, 52 (2004) 2329–2354.CrossRefGoogle Scholar
Liu, C., Foundations of MEMS, Prentice Hall Press, 2011.Google Scholar
Boudreault, G., Jeynes, C., Wendler, E., Nejim, A., Webb, R.P., Wätjen, U., Surface and Interface Analysis, 33 (2002) 478–486.CrossRefGoogle Scholar