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Electromechanical Behavior in Micromachined Piezoelectric Membranes
Published online by Cambridge University Press: 01 February 2011
Abstract
Piezoelectric materials can convert mechanical and electrical energy, a particularly useful tool in developing micro and nanoscale systems. Characterizing the electromechanical behavior is essential to the design and optimization of the material's and device's performance. This paper examines the influence of boundary (clamping) conditions, relative thickness variations between the active one to two micron thick piezoelectric membrane and underlying passive support structure, and the electrode coverage on the electromechanical behavior. Membranes were fabricated with silicon and lead zirconate titanate (PZT) with a ratio of Zr to Ti of 40:60 that provide thickness ratios between 1:2 and 2:1 by depositing the PZT using sequential solution deposition. PZT films contain a tensile stress that accumulates during processing, therefore a compressive stressed layer of tungsten was sputtered on bulk micromachined membranes to produce a near zero net residual stress. A nonlinear finite element numerical simulation technique is utilized for the analysis of the composite thin film. A comparison between the behavioral trends determined by simulation and experimental methods will be discussed.
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- Copyright © Materials Research Society 2004