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Electrodeposition for Hi-MEMS with Special Reference to Fabrication of a Magnetic Mini-Motor

Published online by Cambridge University Press:  10 February 2011

E. J. O'Sullivan ,
E. I. Cooper ,
L. T. Romankiw ,
J. Horkans  and
K. T. Kwietniak
E. J. O'Sullivan
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
E. I. Cooper
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
L. T. Romankiw
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
J. Horkans
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
K. T. Kwietniak
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598
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Abstract

Electrodeposition through photoresist masks is a critical, enabling technology for fabrication of the thick structures (of up to several hundred microns) involved in HI-MEMS. Process integration is an important issue in HI-MEMS. The electrodeposited structure is influenced by the choice of optical or X-ray lithography. Thickness uniformity of the deposit on the wafer scale can be optimized by the use of an auxiliary cathode. On the device or feature scales, thickness uniformity can be improved by the thoughtful design of the pattern to be plated.

A variable reluctance, planar, integrated mini-motor with a 6 mm diameter rotor has been fabricated using lithography, electrodeposition and dielectric planarization processes. The rotors were fabricated separately, released from the substrate, and slipped on the shaft, which was plated up as part of the stator fabrication.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 451: Symposium P – Electrochemical Synthesis and Modification , 1996 , 389
Copyright
Copyright © Materials Research Society 1997

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References

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