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The Effects of Surfactants on the Morphology of Colloidal Crystals in Self-assembly

Published online by Cambridge University Press:  01 February 2011

Zuocheng Zhou
Affiliation:
[email protected], Curtin University of Technology, Dept. of Chemical Engineering, Perth, Western Australia, 6845, Australia
Qin Li
Affiliation:
[email protected], Curtin University of Technology, Dept. of Chemical Engineering, Perth, Western Australia, 6845, Australia
Likui Wang
Affiliation:
[email protected], National University of Singapore, Dept of Chemical and Biomolecular Engineering, Singapore, N/A, N/A, Singapore
Xiusong Zhao
Affiliation:
[email protected], National University of Singapore, Dept of Chemical and Biomolecular Engineering, Singapore, N/A, N/A, Singapore
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Abstract

In this research, sodium dodecyl sulfates (SDS) and N-cetyl-n,n,n-trimethyammonium bromide (CTAB) surfactant solutions are used as solvents of polystyrene (PS) colloidal suspension during the fabrication of colloidal crystals. The effects of the surfactant on the quality and the morphology of the colloidal crystals are studied. It was found that surfactants not only change the charge of PS colloidal particles, but also significantly changed the surface tension and the 3 phase contact angle of the suspension with respect to the glass substrate, in turn they change the thickness of the formed crystal as well as the crystal structure. The derived knowledge will be potentially useful in clarifying the mechanisms involved in the formation of colloidal crystals.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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References

[1] Xia, Y., Gates, B., Yin, Y. and Lu, Y. Adv. Mater. 2000, 12, 693713.Google Scholar
[2] López, C. Adv. Mater. 2003, 15, 16791704.Google Scholar
[3] Arsenault, A., Fournier-Bidoz, S., Hatton, B., Míguez, H., Tetreault, N., Vekris, E., Wong, S., Yang, S. M., Kitaev, V. and Ozin, G. A. J. Mater. Chem. 2004, 14, 781794.Google Scholar
[4] Painter, O., Lee, R. K., Scherer, A., Yariv, A., O‘Brien, J. D., Dapkus, P. D. and Kim, I. Science 1999, 284, 18191821.Google Scholar
[5] Cumpston, B. H., Ananthavel, S. P., Barlow, S., Dyer, D. L., Ehrlich, J. E., Erskine, L. L., Heikal, A. A., Kuebler, S. M., Lee, I. Y. S. M.-M. D., Qin, J., Röckel, H., Rumi, M., Wu, X.-L., Marder, S. R. and Perry, J. W. Nature 1999, 398, 5154.Google Scholar
[6] Lee, K. and Asher, S. A. J. Am. Chem. Soc. 2000, 122, 95349537.Google Scholar
[7] Kotov, N. A., Liu, Y., Wang, S., Cumming, C., Eghtedari, M., Vargas, G., Motamedi, M., Nichols, J. and Cortiella, J. Langmuir 2004, 20, 7887–7792.Google Scholar
[8] Míguez, H., Meseguer, F., López, C., Mifsud, A., Moya, J. S. and VóZquez, L. Langmuir 1997, 13, 60096011.Google Scholar
[9] Jiang, P., Bertone, J. F., Hwang, K. S. and Colvin, V. L. Chem. Mater. 1999, 11, 21322140.Google Scholar
[10] Gu, Z. Z., Fujishima, A. and Sato, O. Chem. Mater. 2002, 14, 760765.Google Scholar
[11] Im, S. H., Lim, Y. T., D. and Suh, J. P. O. O. K. Adv. Mater. 2002, 14, 13671369.Google Scholar
[12] Zhou, Z. and Zhao, X. S. Langmuir 2004, 20, 15241526.Google Scholar
[13] Zhou, Z., Li, Q. and Zhao, X. S. Langmuir 2006, 22.Google Scholar
[14] Deegan, R. D. Phys. Rev. E 2000, 61, 475485.Google Scholar
[15] Marquez, M. and Grady, B. P. Langmuir 2004, 20, 1099811004.Google Scholar
[16] Nguyen, V. X. and Stebe, K. J. Phys. Rev. Lett. 2002, 88, 164501–1-4.Google Scholar
[17] Shim, S.-E., Cha, Y.-J., Byun, J.-M. and Choe, S. J. Appl. Polym. Sci. 1999, 71, 22592269.Google Scholar
[18] Zorin, Z. M., Churaev, N. V., Esipova, N. E., Sergeeva, I. P., Sobolev, V. D. and Gasanov, E. K. J. Colloid Interface Sci. 1992, 152, 170182.Google Scholar
[19] Woodcock, L. V. Nature 1997, 385, 141143.Google Scholar