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Effect of Solid-Solution W Addition on the Nanostructure of Electrodeposited Ni

Published online by Cambridge University Press:  11 February 2011

Hajime Iwasaki ,
Kenji Higashi  and
T. G. Nieh
Hajime Iwasaki
Affiliation:
Department of Materials Science & Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji, Hyogo 671–2201, Japan
Kenji Higashi
Affiliation:
Department of Metallurgy and Materials Science, College of Engineering, Osaka Prefecture University, Sakai 599–8531, Japan
T. G. Nieh
Affiliation:
Lawrence Livermore National Laboratory, L-350, PO Box 808, Livermore, CA 94551, USA
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Abstract

Electrodeposition method was employed to produce freestanding Ni-W alloy foils. The foils consist of nanograins. The structure of the foil, e.g. texture, grain morphology, size distribution, and the nature of grain boundaries, were characterized using X-ray diffraction and high-resolution electron microscopy. The deposited foils exhibit an equiaxed nanocrystalline structure having a grain size value of about 6 nm. Two types of grain boundary structure were observed. One type of grain boundary is essentially one atomic layer thin and another type consists of a structureless layer of about 0.5–1 nm in thickness. Angular dark field (Z-contrast) image of the deposited foils showed an inhomogeneous distribution of W solutes. In some local regions, the W content actually exceeds the equilibrium solid solution limit. Many grain boundaries with a structureless layer of about 0.5–1 nm are probably a result of local supersaturation of W.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 740: Symposium I – Nanomaterials for Structural Applications , 2002 , I3.28
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1. Choo, R.T.C., Toguri, J.M., El-Sharik, A.M., Erb, U., Journal of Applied Electrochemistry 25, 384 (1995).Google Scholar
2. Natter, H., Schmelzer, M., Hempelmann, R. J., Mater. Res. 13, 1186 (1998).Google Scholar
3. Trudeau, M.L., Nanostructured Materials 12, 55 (1999).Google Scholar
4. Grimmett, D.L., Schwartz, M., Nobe, K., Journal of the Electrochemical Society 140, 973 (1993).Google Scholar
5. Erb, U., Nanostructured Materials 6, 533 (1995).Google Scholar
6. Erb, U., El-Sharik, A.M., Palumbo, G., Aust, K.T., Nanostructured Materials 2, 383 (1993).Google Scholar
7. Inoue, A., Acta Mater. 48, 279 (2000).Google Scholar
8. Yamasaki, T., Tomohira, R., Ogino, Y., Schlossmacher, P., Ehrlich, K., Plating and Surface Finishing 87, 148 (1999).Google Scholar
9. Yamasaki, T., Scripta Mater. 44, 1497 (2001).Google Scholar
10. ASM Handbook: Alloy Phase Diagrams. Vol. 3. 1992, Metals Park, OH: ASM.Google Scholar
11. Watanabe, T., Materialia Japan 40, 871 (2001).Google Scholar