Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-27T02:23:03.925Z Has data issue: false hasContentIssue false

The Effect of Hydrogen on the Kinetics of Solid Phase Epitaxy in Amorphous Silicon

Published online by Cambridge University Press:  26 February 2011

J. A. Roth
Affiliation:
Hughes Research Laboratories, Malibu, CA 90265
G. L. Olson
Affiliation:
Hughes Research Laboratories, Malibu, CA 90265
D. C. Jacobson
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
J. M. Poate
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
C. Kirschbaum
Affiliation:
Charles Evans and Associates, Redwood City, CA 94063
Get access

Abstract

This paper discusses the intrusion of H into a-Si layers during solid phase epitaxy and the effect of this H on the growth kinetics. We show that during annealing in the presence of water vapor, H is continuously generated at the oxidizing a-Si surface and diffuses into the amorphous layer, where it causes a reduction in the epitaxial growth rate. The measured variation of growth rate with the depth of the amorphous/crystal interface is correlated with the concentration of H at the interface. The diffusion coefficient for H in a-Si is determined by comparing measured depth profiles with calculated values. Hydrogen intrusion is observed even in layers annealed in vacuum and in inert gas ambients. Thin (<;5000 Åthick) a-Si layers are especially susceptible to this effect, but we show that in spite of the presence of H the activation energy for SPE derived earlier from thin-layer data is in good agreement with the intrinsic value obtained from thick, hydrogen-free layers.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. For a recent review see Olson, G. L. and Roth, J. A., Mat. Sci. Reports 3, 1 (1988).Google Scholar
2. Roth, J. A., Olson, G. L., Jacobson, D. C. and Poate, J. M., Appl. Phys. Lett. 57, 1340 (1990)Google Scholar
3. Revesz, A. G., J. Electrochem. Soc. 126, 122 (1979).Google Scholar
4. Carlson, D. E. and Magee, C. W., Appl. Phys. Lett. 33, 82 (1978).Google Scholar
5. Beyer, W. and Wagner, H., J. Appl. Phys. 53, 8745 (1982).4. S. F. Chou, R. Schwarz, Y. Okada, D. Slobodin and S. Wagner, Mat. Res. Soc. Proc. 95, 165 (1987).Google Scholar
6. Chou, S. F., Schwarz, R., Okada, Y., Slobodin, D., and Wagner, S., Mat. Res. Soc. Proc. 95, 165 (1987).Google Scholar
7. Oberlin, J. C., Chami, A. C., Ligeon, E., and Prunier, C., Nucl. Instrum. Methods B 19/20, 462 (1987).CrossRefGoogle Scholar
8. Walser, R. M., these proceedings.Google Scholar