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Effect of High Temperature Deformation on Grain Boundary Defects in Yba2Cu3O7-X

Published online by Cambridge University Press:  28 February 2011

R. Garcia ,
W.Z. Misiolek ,
R.N. Wright  and
K. Rajan
R. Garcia
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180‐3590
W.Z. Misiolek
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180‐3590
R.N. Wright
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180‐3590
K. Rajan
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180‐3590
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Abstract

The results of transmission electron microscopy studies on YBa2Cu3O7‐x subjected to high temperature extrusion are presented. Particular emphasis is put on high temperature accommodation processes of lattice dislocations into sub‐grain boundaries. It is suggested from the electron microscopy observations that stress induced climb mechanisms for dislocations are operative. Also presented is evidence of localized lattice distortions near twin boundaries due to isothermal high temperature deformation. Preliminary results on the structure of grain boundary facets and steps is described. The implications of these results for texture development in bulk ceramic superconductors is also discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 169: Symposium M – High Temperature Superconductors: Fundamental Properties and Novel Materials Processing , 1989 , 827
Copyright
Copyright © Materials Research Society 1990

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References

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