Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-29T08:00:15.863Z Has data issue: false hasContentIssue false
  • English
  • Français

The Effect of Grain Boundary Geometry on Intergranular Cracking in Ni3A1 at Room Temperature

Published online by Cambridge University Press:  26 February 2011

Hui Lin  and
David P. Pope
Hui Lin
Affiliation:
Department of Materials Science and Engineering, University of Pennsylvania, 3231 Walnut Street, Philadelphia, PA 19104
David P. Pope
Affiliation:
Department of Materials Science and Engineering, University of Pennsylvania, 3231 Walnut Street, Philadelphia, PA 19104
Get access

Abstract

The relation between intergranular fracture and grain boundary character was studied in Ni3Al using the electron backscattering pattern (EBSP) technique. A new and improved set of experiments have been performed in which the problems of forced crack propagation and statistical validity of numerical results encountered in the earlier study were eliminated. It was found that low angle and σ3 boundaries do have a substantially lower propensity for cracking as compared to other boundaries, but there is no correlation between grain boundary σ value and the propensity for cracking for low σ boundaries. These results are in general agreement with recent theoretical predictions of grain boundary structure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 213: Symposium Q – High-Temperature Ordered Intermetallic Alloys IV , 1990 , 391
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Sutton, A.P., International Metals Reviews, 5, 29, (1984).Google Scholar
2. Watanabe, T., Met. Trans., 14A, 531, (1983).CrossRefGoogle Scholar
3. Lin, H. and Pope, D.P., in Proc. Mater. Res. Soc., 132, (1990)Google Scholar
4. Liu, C.T., comments made during Symposium H, MRS Spring Meetings, San Francisco, (1990).Google Scholar
5. Bethea, R.M., Duran, B.S. and Boullion, T.L., Statistical Methods for Engineers and Scientists, Marcel Dekker, New York and Basel, chapter 3, (1975).Google Scholar
6. Dingley, D.J., Scanning Electron Microscopy, IV, 273–286, (1981).Google Scholar
7. Dingley, D.J., Longden, M., Weibren, J. and Alderman, J., Scanning Microscopy, 1, 451–456.Google Scholar
8. Warrington, D.H., J. Microscopy, Pt 3, 301–308, (1974).CrossRefGoogle Scholar
9. Hanada, S., Ogura, T., Watanabe, S., Izumi, O. and Masumoto, T., Acta Metall., 34, 13–21, (1986).CrossRefGoogle Scholar