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Effect of Film Thickness and Cure Temperature on the Mechanical Properties of FOx® Flowable Oxide Thin Films

Published online by Cambridge University Press:  10 February 2011

Huey-Chiang Liou  and
John Pretzer
Huey-Chiang Liou
Affiliation:
Dow Coming Corporation, Semiconductor Fabrication Materials KCI, Midland, MI 48686–0994
John Pretzer
Affiliation:
Dow Coming Corporation, Semiconductor Fabrication Materials KCI, Midland, MI 48686–0994
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Abstract

The mechanical properties and thermal stresses of FOx thin films at different thickness and cured at different temperatures have been investigated by a nanoindentor and a profilometer. In this study, the correlation between structure change, thickness, Si-H/Si-O ratio, modulus, hardness, and calculated coefficient of thermal expansion (CTE) of FOx films have been established. The results show that the modulus of 400°C cured FOx film decreases with increasing film thickness while the hardness slightly varies with increasing film thickness. The calculated CTE of FOx film increases with increasing film thickness. In addition, both the modulus and hardness of FOx films increase with increasing curing temperature. However, the calculated CTE of FOx film decreases with increasing curing temperature. The Si-H/Si-O ratio increases with increasing film thickness but decreases with increasing curing temperature. These results indicate that the increase in modulus and hardness and the decreases in CTE for FOx films are either due to the remaining of Si-H bonds in FOx film at different film thickness or the conversion of Si-H into Si-O when forming the network structure in the FOx film at higher curing temperatures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 565: Symposium O – Low-Dielectric Constant Materials V , 1999 , 239
Copyright
Copyright © Materials Research Society 1999

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