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Effect of Electromigration on Mechanical Behavior of Solder Joints

Published online by Cambridge University Press:  01 February 2011

Fei Ren ,
Jae-Woong Nah ,
Hua Gan ,
Jong-Ook Suh ,
King-Ning Tu ,
Bingshou Xiong ,
Luhua Xu  and
John Pang
Fei Ren
Affiliation:
Dept. of Materials Science and Engineering, UCLA. Los Angeles, CA 90095-1595;
Jae-Woong Nah
Affiliation:
Dept. of Materials Science and Engineering, UCLA. Los Angeles, CA 90095-1595;
Hua Gan
Affiliation:
Dept. of Materials Science and Engineering, UCLA. Los Angeles, CA 90095-1595;
Jong-Ook Suh
Affiliation:
Dept. of Materials Science and Engineering, UCLA. Los Angeles, CA 90095-1595;
King-Ning Tu
Affiliation:
Dept. of Materials Science and Engineering, UCLA. Los Angeles, CA 90095-1595;
Bingshou Xiong
Affiliation:
Dept. of Mechanical and Production Engineering, Nanyang Technological University, Singapore
Luhua Xu
Affiliation:
Dept. of Mechanical and Production Engineering, Nanyang Technological University, Singapore
John Pang
Affiliation:
Dept. of Mechanical and Production Engineering, Nanyang Technological University, Singapore
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Abstract

Electromigration in solder joints causes a void formation between intermetallic compounds (IMC) and solder at the cathode. The effect of electromigration in mechanical test of Cu wires joined by solder was performed. The current density of electromigration was 1∼5×103 A/cm2. The working temperature was 100∼150°C. Tensile stress and shear stress were applied either before or after electromigration. The tensile strain rate was 3 μm/min. We observed that, without electromigration, tensile stress caused a ductile break at the middle of solders because the solder was softer. On the other hand, if combined with electromigration, a brittle failure always occurred at the cathodes interface during tensile test. The ultimate tensile strength decreased with longer electromigration time or higher current density. In shear test, the daisy chain of solders failed alternatively at the cathodes after electromigration.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 863: Symposium B – Materials, Technology and Reliability of Advanced Interconnects , 2005 , B10.2
Copyright
Copyright © Materials Research Society 2005

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