Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-29T09:11:11.003Z Has data issue: false hasContentIssue false

Effect of Boron Doping on the C49 TO C54 Phase Transformation in Ti/Si (100) Bilayers

Published online by Cambridge University Press:  10 February 2011

M. Libera
Affiliation:
Stevens Institute of Technology, Hoboken, NJ, 07030
A. Quintero
Affiliation:
Universidad Central de Venezuela, Ciudad Universitaria, Caracas-Venezuela C. Cabral, Jr., L. A. Clevenger and J. M. E. Harper IBM T. J. Watson Research Center, Yorktown Heights, NY 10598
Get access

Abstract

We have demonstrated that the formation of C54 TiSi2 on Boron-doped single crystal silicon substrates, under RTA annealing conditions in a Nitrogen ambient, leads to a thicker TiN capping surface layer, thinner silicide layer, higher C49 to C54 transformation temperature and greater interface roughness compared to C54 TiSi 2 formation on undoped single crystal silicon substrates. Titanium films 32 nm thick were deposited on undoped and boron-doped single crystal silicon substrates. The films were annealed at 3 /C/isn nitrogen to final quenching temperatures between 500 °C and 900 TC. Ex-situ four point probe sheet resistance, cross sectional transmission electron microscopy (XTEM), high resolution transmission electron microscopy (HRTEM) and x-ray diffraction (XRD) were used to analyze the resulting TiN on TiSi2 bilayer. The C49 to C54 transformation occurs circa 760 TC and 810 TC for the undoped and boron-doped cases respectively. HRTEM observations reveal a thick 20 nm TIN layer on the C54 TiSi2 film in the boron-doped case but only fine dispersed TiN particles embedded on the top of the silicide in the undoped case. It was observed that the resultant silicide in the boron-doped case was thinner and the TiSi2 /Si(100) interface is rougher. XRD and TEM analysis show that in the boron doped case, there is a preferred C54 (040) orientation compared to a random orientation for the undoped case.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Murarka, S. P., Silicidesffor VLSI Applications, Academic Press (1983).Google Scholar
2. Beyers, R. and Sinclair, R., J. App. Phys. 57, 5240 (1985).Google Scholar
3. d'Heurle, F. M., Gas, P., Engstrom, l., Nygren, S., Ostling, M., and Petersson, C. S., IBM Research Report RC 11151 (1985)Google Scholar
4. Jeon, H., Sukow, C.A., Honeycutt, J. W., Rozgonyi, G.A. and Nemanich, R.J., J. Appl. Phys., 71, 4269 (1992).Google Scholar
5. Ma, Z.. and Allen, L.H,. Phys. Rev B 49, 13501 (1994).Google Scholar
6. Clevenger, L. A., Mann, R. W., Roy, R. A., Saenger, K. L., Cabral, C. Jr,. and Piccirillo, J., J. Appl. Phys. 76(12), 7874 (1987).Google Scholar
7. Beyers, R., Merchant, D.Coulman P, J. Appl. Phys. 61(11), 5110 (1987).Google Scholar
8. Mitwalsy, A., Probst, V., and Burmister, R., Proc. 6th Intl. Symp. on Silicon Materials Sci. and Technol., Semiconductor Silicon, The Electrochemical Soc., Proc. Vol.90–7, 876 (1990).Google Scholar
9. Ioint Committee on Powder Diffraction Standards (J(CPDS). (Card Number: 38-1420)Google Scholar
10. Svilan, V., Rodbell, K. P., Clevenger, L. A., Cabral, C. Jr., Roy, R. A., Lavoie, C., Jordan-Sweet, J. and Harper, J. M. E., J. Electronic Mat. (1997) (in press).Google Scholar