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Dynamic Cure and Diffusion Monitoring in Thin Encapsulant Films

Published online by Cambridge University Press:  21 February 2011

David R Day  and
David D. Shepard
David R Day
Affiliation:
Micromet Instruments, Inc.26 Landsdowne St., Suite 150 Cambridge, MA 02139
David D. Shepard
Affiliation:
Micromet Instruments, Inc.26 Landsdowne St., Suite 150 Cambridge, MA 02139
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Abstract

Recent developments in the area of microelectronics now enable the fabrication of microdielectric sensors that can follow the drying, curing, and diffusion phenomena in thin films. This paper first investigates the response of the rricrodielectric sensor to cure in a thin epoxy film. The multi-frequency loss factor data are reduced to a single “ion-viscosity” response curve representative of the change in ion mobility during the cure reaction. The dynanic dielectric data are compared to Tg as a function of time as determined by differential scanning calorimetry (DSC) on several partially cured samples. The dielectric response is shown to be extremely sensitive to the entire cure process. A similar epoxy film is exposed to alternately wet and dry environments while the dielectric response is monitored. The diffusion coefficient of water in the cured resin is estimated through the dynamic change in permittivity using a simple Fickian model and the results are shown to be in good agreement with the literature values. Finally, changes in dielectric properties of a photoresist during UV exposure are presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 142: Symposium U – Nondestructive Monitoring of Materials Properties , 1988 , 227
Copyright
Copyright © Materials Research Society 1989

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References

IA. Bidstrup, S.A., Sheppard, N.F. Jr., Senturia, S.D., Proceedings of the Society of Plastics Engineers Annual Tech. Conf. (ANTEC,45th), May 4th, pg. 987 (1987)Google Scholar
1B. Gotro, J. & Yandrasits, M., Proceedings of the Society of Plastics Engineers Annual Tech. Conf. (ANTEC,45th), May 4th, pg. 1039 (1987)Google Scholar
1C. Lane, J.W., Seferis, J.C., & Bachmann, M.A., Polym. Eng. Scd., 26(5), pg.346 (1986)Google Scholar
2. Day, D.R., Poly. Eng. Sci., 26, 5, 362(1986)Google Scholar
3. Day, D.R. and Sheppard, D.S., Proceeding of the 43rd Annual SPI/Composites Conference (Cincinnati), Feb. 1 (1988)Google Scholar
4. Denton, D.D., Kamou, J., & Senturia, S.D., Proceedings of the 1985 Int. Symp. on Moisture & Humidity, Wash.D.C., April 15, pg.505 (1985)Google Scholar
5. Crank, J.,Mathematics of Diffusion, Oxford Univ. Press (1956)Google Scholar
6. Enns, J.B., Gillham, J.K., J.Appl.Polym.Sci., 28, 2831(1983)Google Scholar
7. Day, D.R., Proceedings of the Society of Plastics Engineers Annual Technical Conference (ANTEC), May 4th, pg.1043 (1987)Google Scholar