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Direct-Write Precision Resistors for Ceramic Packages

Published online by Cambridge University Press:  10 February 2011

P. Yang
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185, [email protected]
D. Dimos
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185, [email protected]
M. A. Rodriguez
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185, [email protected]
R. F. Huang
Affiliation:
Ceramic Technologies Research Laboratory, Motorola Inc., 4800 Alameda Blvd. NE, Albuquerque, NM 87113
S. Dai
Affiliation:
Ceramic Technologies Research Laboratory, Motorola Inc., 4800 Alameda Blvd. NE, Albuquerque, NM 87113
D. Wilcox
Affiliation:
Ceramic Technologies Research Laboratory, Motorola Inc., 4800 Alameda Blvd. NE, Albuquerque, NM 87113
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Abstract

A direct-write approach to fabricate high precision resistors is reported. Special attention is paid to the effect of print thickness on the resistance value of buried resistors after a low temperature co-firing process. The results show that the direct-write approach provides a superior line definition and thickness control over a traditional screen printing process. Microstructural analysis indicates that there is an interdiffused layer developed between the resistor material and the low temperature co-fired ceramic substrate. These observations are consistent with electrical measurements which show that resistance increases as the effective cross-sectional area is reduced. The resistance data show that the standard deviations for resistors printed on a 6” × 6” area are 5% and 15% for the direct-write and the screen-printed patterns, respectively.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

1. Drumheller, C. E., The International Journal for Hybrid Microelectronics 2 (ISHM '82 Proceedings, Reno, NV 1982), p. 449453.Google Scholar
2. Dimos, D. and Yang, P., Ceramic Industry, p. 2528 (1997).Google Scholar