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The Directionality of Interfacial Cracking in Bimaterials

Published online by Cambridge University Press:  25 February 2011

Jian-Sheng Wang  and
Glenn E. Beltz
Jian-Sheng Wang
Affiliation:
Division of Applied Sciences, Harvard University, Cambridge, MA 02138
Glenn E. Beltz
Affiliation:
Division of Applied Sciences, Harvard University, Cambridge, MA 02138
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Abstract

Directionality of interfacial cracking resistance in bicrystals has been predicted by a modified Rice-Thomson model and supported by experimental results on Σ9 [110]/(221) Cu bicrystals in Wang and Anderson's recent work. With the intention of extending this work to the behavior of interfacial cracks in dissimilar materials, Rice, Suo and Wang predicted that this directionality also occurs in bimaterials. Reported here are experimental results on Cu/sapphire specimens, which again support the prediction of the theory. A crack along the interface in a Cu/saprjhire bimaterial is brittle and decohesion of the interface occurs when the crack propagates in the [114]Cu direction, whereas it is ductile and dislocation blunting operates if the crack is intended to propagate in the [114]Cu direction. This finding is significant theoretically and is of helpful in understanding interfacial cracking in composites and film spalling in packaging materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 238: Symposium Cb – Structure and Properties of Interfaces in Materials , 1991 , 405
Copyright
Copyright © Materials Research Society 1992

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References

REFERENces

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