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Device Failures in Pressure Cooker Tests at 130°C

Published online by Cambridge University Press:  25 February 2011

J. F. Burgess  and
A. J. Yerman
J. F. Burgess
Affiliation:
General Electric Company Corporate Research and Development Center Schenectady, NY 12301
A. J. Yerman
Affiliation:
General Electric Company Corporate Research and Development Center Schenectady, NY 12301
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Abstract

The results obtained from Moisture-Temperature-Bias testing of Power- MOSFET at 130°C and 85%RH are examined. A variety of packaging techniques were tested varying from plastic encapsulation materials/methods to fully hermetic. Unprotected devices were tested as controls. The predominant failure mechanism observed was aluminum corrosion, which was manifested initially as a leakage current increase and eventually as visually observable dissolution of aluminum and eventual open circuits.

This paper examines the critical part that surface contamination plays in the corrosion process, particularly where condensed water films can form at the metal surface. The effectiveness of various plastic coating methods are viewed in the light of this concept. Aluminum lead bonds were more susceptable to corrosion than expected. A number of materials were identified that showed resistance to pressure cooker conditions.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 187
Copyright
Copyright © Materials Research Society 1986

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References

1. Peck, D.S., “A Comprehensive Model for Humidity Testing Correlation”. Proc. of IEEE Reliability Physics Symposium 1986.Google Scholar
2. Merrett, R.P., Bryant, J.P. and Studd, R., “An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components” Process of IEEE Reliability Physics Symposium 1983.Google Scholar
3. Ogawa, K., Suzuki, J. and Sano, K., “Automatically Controlled 2- Vessel Pressure Cooker Test Equipment”, IEEE Trans. on Reliability R–32, 2, 1983.Google Scholar
4. Gunn, J., Camenga, R. and Malik, S., “Rapid Assessment of the Humidity Dependence of IC Failure Modes by use of HAST” Proc. of Reliability Physics sym. 1983.CrossRefGoogle Scholar
5. Berg, H. and Paulson, W., “Chip Corrosion in Plastic Packages”, Microelectronics and Reliability Vol.20, pp. 247–263, 1980.Google Scholar
6. Iannuzzi, M., “Reliability and Failure Mechanisms of Non-hermetic Aluminum SIC's: Literaure Review and Bias Humidity Performance” IEEE Trans. on Components, Hybrids and Manufacturing Tech. Vol. CHMT–6,, No. 2, June 1983.Google Scholar
7. Stroehle, D., “Influence of the Chip Temperature on the Moisture - Induced Failure Rate of Plastic-Encapsulated Devices” IEEE Trans. on Components, Hybrids and Manufacturing Tech. Vol. CHMT–6, No.4, Dec. 1983.Google Scholar
8. Edwards, D.R., Heinen, G., Bednary, and Schroen, W., “Test Structure Methodology of IC Package Material Characterization” Proc. of the Electronic Components Conference 1983.Google Scholar
9. Denton, D., Day, D., Priore, D., Senturia, S., Anolick, E. and Scheider, D., “Moisture Diffusion in Polyimide Films in Integrated Circuits”, Journal of Electronic Materials, Vol.14, No. 2, 1985.Google Scholar
10. Mancke, R., “A Moisture Protection Screening Test for Hybrid Circuit Encapsulants”, IEEE Trans. on Components, Hybrids and Manufacturing Tech. Vol. CHMT–4, No. 4, Dec. 1981.Google Scholar
11. Narechania, R., Bruce, J. and Fridmann, S., “Polyimide Adhesion”, Journal Electrochem Soc., Vol.132, No. 11, Nov. 1985.Google Scholar