Hostname: page-component-cd9895bd7-7cvxr Total loading time: 0 Render date: 2024-12-27T01:57:16.927Z Has data issue: false hasContentIssue false
  • English
  • Français

Determination of the Mechanical Response of Thin Films with X-Rays

Published online by Cambridge University Press:  15 February 2011

I. C. Noyan  and
G. Sheikh
I. C. Noyan
Affiliation:
I. C. Noyan IBM Research Division, T. J. Watson Research Center, PO Box 218, Yorktown Heights, NY 10598
G. Sheikh
Affiliation:
G. Sheikh, Dept. of Mining and Metallurgy, Tehran Polytechnic Uni., Tehran, Iran
Get access

Abstract

The mechanical response of a specimen incorporating thin films is dictated by a combination of fundamental mechanical parameters such as Young's moduli of the individual layers, and by configurational parameters such as adhesion strength at the interface(s), residual stress distribution and other process dependent factors. In most systems, the overall response will be dominated by the properties of the (much thicker) substrate. Failure within the individual layers, on the other hand, is dependent on the local strain distributions and can not be predicted from the substrate values alone. To better understand the mechanical response of these systems, the strain within the individual layers of the thin film system must be measured and correlated with applied stresses. Phase selectivity of X-ray stress/strain analysis techniques is well suited for this purpose. In this paper, we will review the use of the traditional x-ray stress/strain analysis methods for the determination of the mechanical properties of thin film systems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 3
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Pethica, J. B., Hutchings, R., Oliver, W. C., Phil. Mag. A, 48, 593 (1983)CrossRefGoogle Scholar
2 Kim, I. and Weil, R. in "Testing of Metallic and Inorganic Coatings", Harding, W.B. and Di Bari, G.A eds., ASTM STP 947, (ASTM, Philadelphia, PA, 1987), p. 11 CrossRefGoogle Scholar
3 Nakahara, S., Okinaka, Y. and Turner, D.R., J. Testing and Evaluation, 5, 178 (1977).Google Scholar
4 Vatakhov, P. and Weil, R., Plating and Surface Finishing, 77, 58 (1990).Google Scholar
5 Mura, T., Micromechanics of Defects in Solids, (Martinus-Nijhof Publishers, Hague, 1982).CrossRefGoogle Scholar
6 Fuks, M. Y., Belozerov, V. V., Fiz. Metal. Metalloved., 34 107 (1972).Google Scholar
7 Kuan, T. S. and Murakami, M., Met. Trans. A., 13A, 383 (1982).CrossRefGoogle Scholar
8 Perry, A. J., Chollet, L.,J. Vac. Sci. Tech. A., 4, 2801 (1986)CrossRefGoogle Scholar
9 Sheikh, G., "Residual Stresses and the Differential Deformation of Plated Structures", Ph.D Thesis, Columbia University, NY, NY. (1990).Google Scholar
10 Sheikh, G. and Noyan, I. C., Adv. in X-Ray An., 33, 161 (1990).Google Scholar
11 Sheikh, G., Berger, A., Noyan, I. C. in "Evolution of Residual Stresses in Thin Films Deposited on Mechanically Strained Substrates", edited by Lillie, E. D., Ho, P. S., Jaccodine, R., Jackson, K.. (MRS Symp. Proc, 203, Pittsburgh, 1991) p. 153 Google Scholar
12 Behnken, H., Hauk, V., Thin Solid Films, 193/194, 333 (1990).CrossRefGoogle Scholar
13 Shute, C. J. and Cohen, J. B., J. Mat. Res., 6, 950 (1991).CrossRefGoogle Scholar
14 Shute, C. J. and Cohen, J. B., Mat. Sci. Eng. A, 149, 167 (1992).CrossRefGoogle Scholar
15 Schadler, L. S., Noyan, I. C., in "Thin Films, Stresses and Mechanical Properties III", edited by Nix, W. D., Bravman, J. C., Arzt, E. and Freund, L. B.. (MRS Symp. Proc., 239, Boston 1992) p. 151 Google Scholar
16 Schadler, L. S., Noyan, I. C., J. Mat. Sci. Let., 11, 1067 (1992)CrossRefGoogle Scholar
17 Schadler, L. S., Noyan, I. C., Proc. IEEE 42th ECTC Conf., 171 (1992).Google Scholar
18 Noyan, I.C., Cohen, J.B., Residual Stress Measurement by Diffraction and Interpretation, (Springer Verlag, NY 1987).Google Scholar
19 Ritter, J.E., Lardner, T. J., Madsen, D. T., Giovinazzo, R. J., J. Mater. Res. (in print).Google Scholar
20 Noyan, I. C., Sheikh, G., J. Mat. Res., 8, 764 (1993)CrossRefGoogle Scholar
21 Noyan, I. C., in Measurement of Residual and Applied Stress Using neutron Diffraction, edited by Hutchings, M. T. and Krawitz, A. D. (Kluwer, Dotrecht, 1992) pp. 51–65 CrossRefGoogle Scholar