A spherical nanoindentation method was developed to evaluate elastic and plastic deformation parameters. The experimental reliability was confirmed by examining fused silica in the elastic deformation range. Yield stress as a quantitative plastic parameter was estimated using the Hertz contact theory and Tresca yield criterion. A copper thin film and two types of low-k thin film were examined. Reduced modulus was almost the same as the value obtained for the Cu (100) plane and yield stress was found to be between single crystals Cu (111) and Cu (100). These mechanical properties were thought to be dependent on the crystal orientation of the copper thin film. The two types of MSQ low-k film exhibited a difference in yield stress, although hardness was estimated to be similar by using the conventional nanoindentation method. These results have never been seen on a micro-mater scale.