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Detection of Metallic Inclusions in Metals by Thermoelectric Coupling

Published online by Cambridge University Press:  17 March 2015

Hector Carreon*
Affiliation:
Instituto de Investigaciones Metalúrgicas, Edif.“U” Ciudad Universitaria Morelia, MICH 58000-888, MEXICO
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Abstract

A comparison between reported analytical results with experimental data of the magnetic flux density on cylindrical tin inclusions of elliptical cross-section embedded in a copper matrix under external thermal excitation is presented. By changing the aspect ratios b/a designated by e of the elliptical inclusions, a wide range of real situation such as slender inclusions can be simulated. The experimental magnetic field distribution illustrated the potential for the non contacting thermoelectric technique to detect and characterize metallic inclusions of different geometries based on their magnetic signature. Preliminary results on a cylindrical hard alpha (TiN) inclusion embedded in Ti–6Al–4V matrix is also presented to demonstrate that the proposed non-destructive method might be applicable to a wide range of alloys including high-strength, high-temperature engine materials.

Type
Articles
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Tavrin, Y.Y, Krivoy, G.S., Hinken, J.H. and Kallmeyer, J.P., in Review of progress in quantitative NDE, 20, 1710 (2001).CrossRefGoogle Scholar
Maslov, K. and Kinra, V.K., Mater. Eval. 59, 1081 (2001).Google Scholar
Carreon, H., Lakshminarayan, B., Faidi, W.I and Nayfeh, A.H., NDT & E Int. 36, 339 (2003).CrossRefGoogle Scholar
Carreon, H., NDT & E Int. 39, 22 (2006).CrossRefGoogle Scholar
Tavrin, Y., Siegel, M. and Hinken, J.H., IEEE Trans. Appl. Supercond. 9, 3809 (1999).CrossRefGoogle Scholar
Nayfeh, A.H. and Faidi, W.I., Eur. Phys. J. Appl. Phys. 19, 153 (2002).CrossRefGoogle Scholar
Nagy, P.B. and Nayfeh, A.H., J. Appl. Phys. 87, 7481 (2000).CrossRefGoogle Scholar
Carreon, H., Exp. Therm. & fluid Sci. 44, 673 (2013).CrossRefGoogle Scholar
Yu, F., NDT & E Int. 43, 182 (2010).CrossRefGoogle Scholar
Carreon, H., Barriuso, S., Barrera, G., González, J.L and Caballero, F.G., Surf. & Coat. Tech. 206, 2941 (2012).CrossRefGoogle Scholar
Carreon, H., Barriuso, S., Porro, J., González-Carrasco, J. and Ocaña, J., Opt. Eng. 53, 122502–1 (2014)CrossRefGoogle Scholar