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Published online by Cambridge University Press: 15 February 2011
Amorphous hydrogenated silicon (a-Si:H) films were deposited from disilane at substrate temperatures between 180 and 390 °C using a F2-laser (157 nm) in a parallel configuration. Material properties such as hydrogen content, SiH and SiH2 group concentration, photo-and dark conductivity, band-gap energy and the Urbach parameter were determined as a function of the deposition temperature. The material with the best optical and electronical properties was found for a substrate temperature of 260 °C. Using argon as the buffer gas instead of helium results in films of poor quality.