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Dependence of Cu/Sn and Cu/60Sn40Pb Solder Joint Strength on Diffusion Controlled Growth of Cu3Sn and Cu6Sn5

Published online by Cambridge University Press:  22 February 2011

D. S. Dunn ,
T. F. Marinis ,
W. M. Sherry  and
C. J. Williams
D. S. Dunn
Affiliation:
AT&T Bell Labortories, 555 Union Boulevard, Allentown, PA 18103
T. F. Marinis
Affiliation:
AT&T Bell Labortories, 555 Union Boulevard, Allentown, PA 18103
W. M. Sherry
Affiliation:
AT&T Bell Labortories, 555 Union Boulevard, Allentown, PA 18103
C. J. Williams
Affiliation:
Student, Virginia Polytechnic Institute, Summer Employee
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Abstract

The growth of intermetallic compounds and the strength of Cu/ Sn and Cu/ 60Sn40Pb butt joints were studied as a function of isothermal aging. The effects of single-crystal (100), (110), and (111) oriented copper on the growth rates of Cu3Sn and Cu6Sn5 intermetallic compounds are characterized and the influence of elevated temperature aging on the tensile strength of butt joints analyzed. Substrate orientation appears to influence the growth rate. Metallographic measurements showed that the intermetallic compounds grew at a rate proportional to the square root of time. Tensile tests of aged butt joints revealed a more complex time dependence.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 129
Copyright
Copyright © Materials Research Society 1985

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References

[1] Olsen, D., Wright, R., and Berg, H., “Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Parts,” 13th Annual Proceedings of the Reliability Physics Symposium, April, 80, (1980).Google Scholar
[2] Thwaites, C. J., and Hampshire, W. B., “Mechanical Strength of Selected Solder Joints and Bulk Solder Alloys,” Welding Research Supplement, 323s, (1976).Google Scholar
[3] Chadwick, R., “The Influence of Surface Alloying on the Strength of Soft Solder Joints,” J. Inst. Met., 62 277, (1938).Google Scholar
[4] Onishi, M., and Fujibuchi, H., “Reaction-Diffusion in the Cu-Sn System,” Trans. Japan Inst. Metal,.16, 539, (1975).Google Scholar
[5] Unsworth, D. A., and Mackay, C. A., “A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated With Tin and Its Alloys,” Trans. Inst. of Metal Finish., 51, 85, (1973).CrossRefGoogle Scholar
[6] Zakraysek, L., “Intermetallic Growth in Tin-Rich Solders,” Welding Research Supplement, November, 536s, (1972).Google Scholar
[7] Tu, K. N., “Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films,” Acta Metallurgica, 21, 347, (1973).Google Scholar
[8] Cogan, S. F., Kwon, S., Klein, J. D., and Rose, R. M., “Diffusion in the Cu-Sn Binary System: Application to Nb3Sn Composites,” J. Mat. Sci., 19, 497, (1984).Google Scholar
[9] Revay, L., “Interdiffusion and Formation of Intermetallic Compounds in Tin-Copper Alloy Surface Coatings,” Surface Technology, 5, 57, (1977).Google Scholar
[10] Tu, K. N., and Thompson, R. D., “Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin Films,” Acta Metallurgica, 3M, 947, (1982).Google Scholar
[11] Hu, C. K., Huntington, H. B., and Cruzalski, G. R., “Atom Motions of Copper Dissolved in Lead-Tin Alloys,” Physical Review B, 28, 579, (1983).Google Scholar
[12] Dyson, B. F., Anthony, T. R., and Turnbull, D., “Interstitial Diffusion of Copper in Tin,” J. Appl. Phys., 38, 3408, (1967).CrossRefGoogle Scholar
[13] Brooks, P. L., and Gilliam, E., “The ɛ Phase in the Cu-Sn System,” Acta Met., 18, 1181, (1970).Google Scholar
[14] Gangulee, A. Das., G. C., and Bever, M. B., “X-Ray Diffraction and Calorimetric Investigation of the Compound Cu6Sn5,” Met. Trans., 4, 2063, (1973).Google Scholar
[15] Griffith, J. R., and Charles, J. A., “The Strength of Solder Joints,” Metal Sci. J., 2, 89, (1968).Google Scholar
[16] Rayne, J. A., and Bauer, C. J., “Effect of Intermetallic Phase Formation on Electrical and Mechanical Properties of Flash-Welded Al-Cu Couples,” Proceedings of the Fifth Bolton Landing Conference, ed. Christoffel, R. J., Nippes, E. F., and Solomon, H. D., General Electric Co., 353, (1979).Google Scholar
[17] Hagstrom, R. A., and Wild, R. N., “Evaluation of Solders for IBM System/4 Pi Computers,” International Electronic Packaging and Production Conference, Brighton, England, 271, (1969).Google Scholar