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Debond Crack Propagation and Branching Under Varying Shear Stresses

Published online by Cambridge University Press:  01 January 1992

C. M. Kennefick
Affiliation:
NASA Lewis Research Center, 21000 Brookpark Road, Cleveland, OH 44135
R. M. Dickerson
Affiliation:
NASA Lewis Research Center, 21000 Brookpark Road, Cleveland, OH 44135
P. O. Dickerson
Affiliation:
NASA Lewis Research Center, 21000 Brookpark Road, Cleveland, OH 44135
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Abstract

Silicon carbide fibers in a Ti24Al+llNb matrix were debonded under varying combinations of shear and compression in off axis loading in a pushout test. Evidence of debond crack branching was recorded for etched specimens using scanning electron microscopy and the interface microstructure was examined by transmission electron microscopy. The regions of high shear stress and multiple weak interfaces promoting crack branching were analyzed in terms of an energy balance for brittle fracture.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

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