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Curvature Measurements of Tri-Material Structures Under Thermal Excursion

Published online by Cambridge University Press:  26 February 2011

Guo-Quan Lu ,
Boris Mogilevsky  and
Tapan K. Gupta
Guo-Quan Lu
Affiliation:
Alcoa Electronic Packaging, Inc., Alcoa Center, PA 15069
Boris Mogilevsky
Affiliation:
Alcoa Electronic Packaging, Inc., Alcoa Center, PA 15069
Tapan K. Gupta
Affiliation:
Alcoa Electronic Packaging, Inc., Alcoa Center, PA 15069
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Abstract

The bending curvatures of tri-material plates have been measured using in situ laser reflection technique at temperatures ranging from 20°C to 160°C. The tri-material structures are formed by attaching silicon wafers to ceramic substrates with die-attach adhesives from solder-like (elastic modulus ≈ 24 GPa) to gel-like (elastic modulus ≈ 0.003 GPa) characteristics. The temperature dependence of curvature as a result of the thermal expansion mismatch is measured. The structure bonded by the gel-like adhesive has substantially lower, about a factor of ten less, bending than the structures attached by the other two types of adhesives. We found good agreements between the measurements and the theoretical derivations by Suhir[1] for the bending curvature of finite tri-material assembly.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 339
Copyright
Copyright © Materials Research Society 1991

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References

[1]. Suhir, E., in Proc. Int. Syrup. on Microelectronics, Atlanta, GA., 1986, pp. 383–392.Google Scholar
[2]. Johnson, E.A., Chen, W.T., and Lim, C.K., in Principles of Electronic Packaging, edited by Seraphim, D.P. et al. (McGraw-Hill, 1989), pp. 159–195.Google Scholar
[3]. Feinstein, L.G., in Electronic Packaging Handbook, Vol.1, prepared by the ASM International Committee (Materials Park, OH., 1986) pp. 213–224.Google Scholar
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