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Cross-Sectional TEM Study of Three-Dimensional MOS Devices
Published online by Cambridge University Press: 28 February 2011
Abstract
This paper describes cross-sectional transmission electron microscopy (TEM) observation on finished 3-D MOS devices, fabricated with a laser-recrystallized SOI. The laser-recrystallized SOI contained crystal defects such as micro-twinning, grain boundaries and dislocations. It is also clearly shown that the interface roughness between the gate oxide and SOI is as much as 20 nm height, in where the interface is very smooth between the gate oxide and bulk silicon.
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- Copyright © Materials Research Society 1988
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