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Corrosion and Protection of Thin Metallic Films

Published online by Cambridge University Press:  21 February 2011

V. Brusic  and
G. S. Frankel
V. Brusic
Affiliation:
IBM Research Division, TJ. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
G. S. Frankel
Affiliation:
IBM Research Division, TJ. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598
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Abstract

Well known principles governing metallic corrosion are summarized in this paper. Severalelectrochemical techniques that are suitable for evaluation of corrosion reactions and mechanisms are discussed. The challenge of minimizing metallic degradation in processing, in storage and during operation is discussed with examples drawn from thin films used inthe electronics industry.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 437
Copyright
Copyright © Materials Research Society 1993

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References

1. Pourbaix, M., Atlas of Electrochemical Equilibria in Aqueous Solutions. 1st English ed. (Pergamon Press, New York, 1966).Google Scholar
2. West, J. M. Electrodeposition and Corrosion Processes, (D. Van Nostrand Co., London, 1965)Google Scholar
3. Wagner, C. and Traud, W., Z. Electrochem., 44, 391 (1938)Google Scholar
4. Kortum, G. and Bockris, J. O'M., Textbook of Electrochemistry. (Elsevier, New York, 1951).Google Scholar
5. Latimer, W. M., Oxidation Potentials. (Prentice Hall, Engelwood Clifs, 1952).Google Scholar
6. West, J. M., Basic Corrosion and Oxidation. (Ellis Horwood Ltd and J. Wiley &Sons, New York, 1980).Google Scholar
7. Brusic, V., Russak, M., Schad, R., Frankel, G., Selius, A., Dimilia, D. and Edmonson, D., J. Electrochem. Soc., 136 42 (1989).Google Scholar
8. Will, F. G., Janora, K. H., McMulen, J. G. and Yerman, A. J., Ann. Proc. Reliab. Phys., 25, 34 (1987).Google Scholar
9. Koelmans, H., 12th Ann. Proc. Reliab. Phys., 168 (1974).Google Scholar
10. Anderson, J., Markovac, V. and Troyk, P. R., IEEE Trans. on Comp., Hybr. and Mfg. Techn., 11, 152 (1988).Google Scholar
11. Lannuzzi, M., IBEE Trans. on Comp., Hybr., and Mfg. Techn., CHIMT–4, 181 (1983)Google Scholar
12. Kinsman, K. R. in Electronic Packaging and Corrosion in Microelectronics, Proc. ASM's Third Conf. on Electronic Packaging. Nicholson, M. ed., ASM international US Lib. Cong. Cat. Card Nm 87-070253 Minneapolis, MN April 1987 Google Scholar
13. Rice, D. W., Phipps, P. B. P. and Tremoureux, R., J. Electrochem. Soc. 126, 1459 (1979).CrossRefGoogle Scholar
14. Sinclair, J. D. in Electronic Packaging and Corrosion in Microelectronics. Proc. ASM's Third Conf. on Electronic Packaging. Nicholson, M. ed., ASM international US Lib. Cong. Cat. Card Nm 87-070253 Minneapolis, MN April 1987,Google Scholar
15. Lobnig, R. E., Frankenthal, P. P., Siconolfi, D. J. and Sinclair, J. D., presented at the 2nd Int. Symp. on Corrosion of Electronic Materials and Devices at the 182nd Meeting of the Electrochem. Soc., Toronto, October 1992.Google Scholar
16. White, M. L., Encapsulation of integrated circuits, Proc. IEEE 57, 1610 (1969).Google Scholar
17. Brusic, V., Horkans, J. and Barclay, D. J. in Electrochemistry in Transition from 20st to 21st Century, Murphy, O. and Srinivasan, S. eds., (Plenum Press, New York, 1992) pp 547–560 Google Scholar
18. Novotny, V. and Staud, N., J. Electrochem. Soc., 135, 2931 (1988).Google Scholar
19. Phipps, P. B. P and Rice, D. W. in Corrosion Chemistry. Brubaker, G. R. and Phipps, P. B. P. eds., American Chemical Soc., Washington DC (1979) pp 235–261 CrossRefGoogle Scholar
20. Ven, E. P. G. T. van de and Koelmans, H., JECS, 123, 143 (1976)Google Scholar
21. Wang, T. G. and Warren, G. W., IEEE Trans. Magn., MAG–24, 340 (1986).CrossRefGoogle Scholar
22. Tagami, K. and Hayashida, H., IEEE Trans. Magn., MAG–23, 3648 (1987)Google Scholar
23. Novotny, V. J., Adv. Info. Storage Syst., 4, 255 (1992)Google Scholar
24. Brusic, V., Frankel, G. S., Hu, C-K., Plechaty, M. M. and Rush, B. M., Corrosion, 47, 35 (1991)Google Scholar
25. Poon, S., Pan, J. T., Wang, T-C. and Nelson, B., Proc. Tech. Program NEPCON meeting 89, 1426, Anahen Ca, March 1989 Google Scholar
26. Brusic, V., Frisch, M. A., Eldridge, B. N., Novak, F. P., Kaufman, F. B., Rush, B. M. and Frankel, G. S., J. Electrochem. Soc., 138, 2253 (1991).Google Scholar
27. Nguyen, L. T., SPE 46th ANTEC, Atlanta Ga (1988)Google Scholar
28. Welsher, T. I., Mitchell, J. P. and Lando, D. J., 18th Ann. Proc. Reliability Physics 1980, IEEE Cat. No. 80CH1531-3, 235 (1980)Google Scholar
29. Howard, J. K., US Patent No 4,789,598 (December 6 1988).Google Scholar