Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-29T09:01:29.405Z Has data issue: false hasContentIssue false
  • English
  • Français

Cooling Power Density of SiGe/Si Superlattice Micro Refrigerators

Published online by Cambridge University Press:  01 February 2011

Gehong Zeng ,
Xiaofeng Fan ,
Chris LaBounty ,
Edward Croke ,
Yan Zhang ,
James Christofferson ,
Daryoosh Vashaee ,
Ali Shakouri  and
John E. Bowers
Gehong Zeng
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106
Xiaofeng Fan
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106
Chris LaBounty
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106
Edward Croke
Affiliation:
HRL Laboratories, LLC, Malibu, California, 90265
Yan Zhang
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
James Christofferson
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Daryoosh Vashaee
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
Ali Shakouri
Affiliation:
Baskin School of Engineering, University of California, Santa Cruz, CA 95064
John E. Bowers
Affiliation:
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106
Get access

Abstract

Experiments were carried out to determine the cooling power density of SiGe/Si superlattice microcoolers by integrating thin film metal resistor heaters on the cooling surface. By evaluating the maximum cooling of the device under different heat load conditions, the cooling power density was directly measured. Both micro thermocouple probes and the resistance of thin film heaters were used to get an accurate measurement of temperature on top of the device. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Various device sizes were characterized. The maximum cooling and the cooling power density had different dependences on the micro refrigerator size. Net cooling over 4.1 K below ambient and cooling power density of 598 W/cm2 for 40 × 40 μm2 devices were measured at room temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 793: Symposium S – Thermoelectric Materials 2003 - Research and Applications , 2003 , S2.2
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Venkatasubramanian, R., Siivola, E., Colpitts, T., and O'Quinn, B., Nature 413, 597–602 (2001).Google Scholar
2. Goldsmit, H. J., Thermoelectric Refrigeration (Plenum, New York, 1964).Google Scholar
3. Vining, J. B., J. Appl. Phys. 69, 331–341 (1991).Google Scholar
4. Shakouri, A. and Bowers, J. E., Appl. Phys. Lett., 71, 1234 (1997).Google Scholar
5. Shakouri, A., LaBounty, C., Abraham, P., Piprek, J., and Bowers, J. E., Mater. Res. Soc. Symp. Proc. 545, 449 (1999).Google Scholar
6. Shakouri, A. and Bowers, J. E., in The 16th International Conference on Thermoelectrics, Dresden, Germany, 26–29 Aug. 1997, p. 636–40.Google Scholar
7. Shakonri, A., LaBounty, C., Abraham, P., Piprekt, J., Bowers, J. E., in The Next Generation Materials for Small-Scale Refrigeration and Power Generation Applications Symposium, Boston, MA, USA 30 Nov.-3 Dec. 1998, p. 449–58.Google Scholar
8. Mahan, G. D. and Woods, L. M., Physical Review Letters 80, 4016–19 (1998).Google Scholar
9. Vining, C. B. and Mahan, G. D., Journal of Applied Physics 86, 6852–3 (1999).Google Scholar
10. Hicks, L. D. and Dresselhaus, M. S., Physical Review B (Condensed Matter) 47, 12727–31 (1993).Google Scholar
11. Hicks, L. D., Harman, T. C., and Dresselhaus, M. S., Applied Physics Letters 63, 3230–2 (1993).Google Scholar
12. Koga, T., Sun, X., Cronin, S. B., and Dresselhaus, M. S., Applied Physics Letters 73, 2950–2 (1998).Google Scholar
13. Koga, T., Sun, X., Cronin, S. B., and Dresselhaus, M. S., Applied Physics Letters 75, 2438–40 (1999).Google Scholar
14. Koga, T., Cronin, S. B., Dresselhaus, M. S., Liu, J. L., and Wang, K. L., Applied Physics Letters 77, 1490–2 (2000).Google Scholar
15. Xiaofeng, F., Gehong, Z., LaBounty, C., Bowers, J. E., Croke, E., Ahn, C. C., Huxtable, S., Majumdar, A., and Shakouri, A., Applied Physics Letters 78, 1580–2 (2001).Google Scholar
16. Xiaofeng, F., Gehong, Z., Croke, E., Robinson, G., LaBounty, C., Shakouri, A., Bowers, J. E., in The 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA 23–26 May 2000, p. 304–7.Google Scholar
17. Gehong, Z., Shakouri, A., Bounty, C. L., Robinson, G., Croke, E., Abraham, P., Xiafeng, F., Reese, H., and Bowers, J. E., Electronics Letters 35, 2146–7 (1999).Google Scholar
18. Osten, H. J., Journal of Applied Physics 84, 2716–21 (1998).Google Scholar
19. Stein, B. L., Yu, E. T., Croke, E. T., Hunter, A. T., Laursen, T., Bair, A. E., Mayer, J. W., and Ahn, C. C., in The 24th Conference on the Physics and Chemistry of Semiconductor Interfaces Research, Triangle Park, NC, USA 12–15 Jan. 1997, p. 1108–11.Google Scholar
20. LaBounty, C., Shakouri, A., Robinson, G., Abraham, P., and Bowers, J. E., in The 18th International Conference on Thermoelectrics, Baltimore, MD, USA 29 Aug.-2 Sept. 1999, p. 23–6.Google Scholar
21. LaBounty, C., Shakouri, A., and Bowers, J. E., Journal of Applied Physics 89, 4059–64 (2001).Google Scholar
22. Christofferson, J., Vashaee, D., Shakouri, A., Melese, P., Xiaofeng, F., Gehong, Z., Labounty, C., Bowers, J. E., and Croke, E. T. III, in The 17th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, USA 20–22 March 2001, p. 58–62.Google Scholar
23. Coldren, L. and Corzine, S., Diode Lasers and Photonic Integrated Circuits (John Wiley & Sons, Inc., New York, 1995).Google Scholar
24. LaBounty, C., Ph.D. Thesis, University of California, Santa Barbara, 2001.Google Scholar
25. Vashaee, D., Shakouri, A., Labounty, C., Zeng, G., Fan, X., Bowers, J. E., and Croke, E. T., III, manuscript in preparation.Google Scholar