Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-25T18:40:37.089Z Has data issue: false hasContentIssue false
  • English
  • Français

Configured Semiconductor/Insulator Coatings for Corrosion Prevention

Published online by Cambridge University Press:  21 February 2011

F. C. Jain ,
J. J. Rosato ,
K. S. Kalonia  and
V. S. Agarwala
F. C. Jain
Affiliation:
University of Connecticut, Department of Electrical and Systems Engineering, 260 Glenbrook Road, U-157, Storrs, CT 06268
J. J. Rosato
Affiliation:
University of Connecticut, Department of Electrical and Systems Engineering, 260 Glenbrook Road, U-157, Storrs, CT 06268
K. S. Kalonia
Affiliation:
University of Connecticut, Department of Electrical and Systems Engineering, 260 Glenbrook Road, U-157, Storrs, CT 06268
V. S. Agarwala
Affiliation:
U. S. Naval Air Development Center, Warminster, PA 18974
Get access

Abstract

Semiconductor and insulator coatings, appropriately configured in Metal-Semiconductor (MS) and Metal-Insulator (≈20–100Å)-Semiconductor (MIS) structural formats, are shown to result in the formation of a built-in active electronic barrier on metal surfaces. This interfacial electronic barrier impedes the transfer of electrons from the metal to oxidizing species present at the metal surface, thereby providing protection against corrosion. The effectiveness of the electronic barrier concept has been confirmed using weight-loss, and cathodic and anodic polarization measurements on aluminum samples coated with indium tin oxide ITO (semiconductor) and SiO2 (thin oxide/insulator) films. In particular, Al-ITO, Al-ITO-Si3N4, Al-SiO2-ITO, and Al-SiO2-ITO-Si3N4 structures were fabricated and tested in a 1% NaCl, pH-2 solution. The films were grown using chemical vapor deposition (CVD) and spray techniques to ensure high quality and reproducibility. Aluminum samples tested included commercial purity, high purity (polycrystalline and single crystalline), and alloy (7075-T6). The MS and MIS configurations were found to provide superior corrosion protection as compared to conventional insulating films (e.g., Al-Si3N4). The active electronic barrier approach is a generic methodology to inhibit corrosion, and it can be realized using other semiconductor/insulator combinations including semiconducting polymer coatings.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 125: Symposium N – Materials Stability and Environmental Degradation , 1988 , 329
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Scully, J.C., The Fundamentals of Corrosion, Permagon, New York (1975).Google Scholar
2. Bianconi, A., Solid State Comm., 24 539 (1977).CrossRefGoogle Scholar
3. Yu, H.L., Munoz, M.C., and Soria, F., Surface Science 94, L184 (1980).Google Scholar
4. Bullett, B.W., Surface Science, 93, 213–222 (1980).Google Scholar
5. Appelbaum, J.A., Electronic structure of solid surfaces, Chapter 2, in Surface Physics of Materials, Vol.1, Ed. Blakely, J.M., Academic Press, N.Y. (1975).Google Scholar
6. Munoz, M.C., Martinez, V., Tagle, J.A., and Sacedon, L.D., Phys. Rev. Lett. 44, 814 (March 1980).CrossRefGoogle Scholar
7. Pantelides, S.T. (Ed.), The Physics of SiO2 and its Interfaces, Pergamon, N.Y. (1978)Google Scholar
8. Morrison, S. Roy, The Chemical Physics of Surfaces, Plenum Press, New York, 1977; also in Surface Physics of Phosphors and Semiconductors (chapter 4), Eds. Scott, C.G. and Reed, C.E., Academic Press, New York (1975).Google Scholar
9. Schrieffer, J.R. and Soven, P., Phys. Today, 28, 24 (1975).CrossRefGoogle Scholar
10. Tomashov, N.D., Theory of Corrosion and Protection of Metals, MacMillan, New York (1966).Google Scholar
11. Barton, K., Protection Against Atmospheric Corrosion: Theories and Methods, Wiley Interscience, New York (1976).Google Scholar
12. Carter, V.E., Metallic Coatings for Corrosion Control, Newnes-Butterworths, Boston (1977).Google Scholar
13. Wagner, C., Corrosion Science 13, 23–52 (1973).Google Scholar
14. Fromhold, A.T., Theory of Metal Oxidation, Vol. 1- Fundamentals, in Series on Defects in crystalline solids, Vol.9, North-holland (1976).Google Scholar
15. Fromhold, A.T., Theory of Metal Oxidation, Vol. 2- Space Charge, in Series on Defects in solids, Volume 12, North-Holland (1980).Google Scholar
16. Jain, F. C., Semiconductor/Insulator Films in Corrosion Prevention, Private Comm. to NADC September (1980).Google Scholar
17. Sze, S.M., Physics of Semiconductor Devices, second edition, John Wiley, New York (1981).Google Scholar
18. Milnes, A.G. and Feucht, D.L., Heterojunctions and Metal-Semiconductor Junctions, Academic Press, N.Y. (1972).Google Scholar
19. Muller, R.S. and Kamins, T.I., Device Electronics for Integrated Circuits, Wiley, N.Y. (1977).Google Scholar
20. Andrews, J.M. and Phillips, J. C., Phys. Rev. Lett. 35, 56 (1975).CrossRefGoogle Scholar
21. Brillson, L.J., Phys. Rev. Lett. 42, 397 (1979).Google Scholar
22. Ottaviani, G., Tu, K.N., and Mayer, J.W., Phys. Rev. Lett. 44, 284 (1980). (Reference is made to the Proceedings of Conference on Physics and Chemistry of Semiconductor Interfaces (PCSI), 1983, 1984).Google Scholar
23. Nicollian, E.H., Schwartz, B., Coleman, D.J. Jr., Ryder, R.M., and Brews, J.R., J. Vac. Sci. Technol., 13, 1047, (Sept./Oct 1976).CrossRefGoogle Scholar
24. Jain, F.C. and and Marciniec, J.W., IEEE J. Quantum Electronics, QE-14, 398 (1978).CrossRefGoogle Scholar
25. Jain, F.C. and Nichols, C.S., Bull. Am. Phys. Soc. 25, 586 (1979); P.A. Dufilie and F.C. Jain, Bull. Am. Phys. Soc., 31, 884, 1986.Google Scholar
26. Jain, F.C., Electronic Barrier Formation of Metal-Semiconductor/Insulator Interfaces: A New Approach to Corrosion Prevention, Corr. Tech. Rev. Conf., August 14–16, 1984, NADC, Warminster, PA (Abstract Published).Google Scholar
27. Jain, F.C., Rosato, J.J., and Kalonia, K.S., Bull. Am. Phys. Soc. 30, 711, April 1985.Google Scholar
28. Jain, F.C., Technical Report Department of the Navy, “Semiconductor/Insulator Films for Corrosion Prevention”, Report No. NADC-86028–60, October 1985.Google Scholar
29. Jain, F.C., Rosato, J.J., Kalonia, K.S., and Agarwala, V.S., Corrosion, 42, pp. 700–707 (1986).Google Scholar
30. Froment, M., Passivity of Metals and Semiconductors, Elsevier (1983). (Proceedings of the Fifth Internation Symposium on Passivity, Bombanness, France, May 30-June 3, 1983).Google Scholar
31. Fontana, M.D. and Greene, N.D., Corrosion Engineering, McGraw-Hill, New York (1978).Google Scholar
32. Jain, F.C., Rosato, J.J., Kalonia, K.S., and Agarwala, V.S. in Adhesives, Sealants, and Coatings for Space and Harsh Environments, edited by L-H., Lee (Plenum Publishing Corp., New York, 1988), pp. 381–405.Google Scholar
33. Dodelet, J.P., J. Appl. Phys. 53, 4270–4277, (1982).CrossRefGoogle Scholar
34. Koshida, N. and Wachi, Y., Appl. Phys. Lett. 45, 436–437, (1984).CrossRefGoogle Scholar
35. Bhuiyan, A.H. and Bhoraskar, S.V., Proceedings of the ACS Division of Polymeric Materials: Science and Engineering, Vol 56, pp. 609–613., (1987).Google Scholar
36. Hettiarachchi, S., Wilson, R.B., Chan, Y.W., and Agarwala, V.S., Materials Research Society's 1988 Spring Meeting, Abstract #N8.2, p. 266 (April 5–9).Google Scholar