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Conduction Mechanisms in Discontinuous Copper Films

Published online by Cambridge University Press:  28 February 2011

P. BiegaŃski  and
E. Mozrzymas-Dobierzewska
P. BiegaŃski
Affiliation:
Institute of Physics, Technical University of Wrocław, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
E. Mozrzymas-Dobierzewska
Affiliation:
Institute of Physics, Technical University of Wrocław, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
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Abstract

Copper films of coverage coefficients ranging between 0.2 and 1 were evaporated onto glass substrates under vacuum conditions (p ≃ 10−8 Torr). For these films, the temperature dependences of resistance were measured in vacuo in situ. Making use of the obtained data TCR values, as a function of coverage coefficient and the activation energy for the films with different coverage coefficients were established. The resistance of films was found to change, and TCR values approaching zero for coverage coefficients between 0.63 and 0.75. This interval (∆qc) can be regarded as the percolation interval for discontinuous Cu films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 195: Symposium S – Physical Phenomena in Granular Materials , 1990 , 211
Copyright
Copyright © Materials Research Society 1990

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References

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