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Computer Simulations of Two-Dimensional Sn-Cu Alloys on (100) and (111) Cu Surfaces

Published online by Cambridge University Press:  10 February 2011

Jose F. Aguilar
Affiliation:
Department of Physics and Materials Research Institute, University of Texas, El Paso, TX 79968
R. Ravelo
Affiliation:
Department of Physics and Materials Research Institute, University of Texas, El Paso, TX 79968
M. Baskes
Affiliation:
Sandia National Labs., Livermore, CA
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Abstract

We have performed calculations of Sn deposition on Cu(111) and Cu(100) surfaces. The atomic interactions are described by modified embedded atom method (MEAM) potentials. This is a modification of the embedded atom method (EAM) to include higher moments in the electron density. We find the at low coverages Sn deposited on Cu(111) leads to the formation of a two-dimensional (2D) alloy phase with a p (√3 × √3)-R 30° structure which is stable up to temperatures of 900K. These results are in agreement with ion-scattering experiments of thin films of Sn on Cu(111). For deposition of Sn on Cu(100), a 0.25 monolayer (ML) coverage results in the formation of a stable 2D alloy phase with a p(2 × 2) structure. This result is also in agreement with LEED measurements.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

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