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Computer Simulation of Materials Failure Processes in a Thermal or Radiational Environment

Published online by Cambridge University Press:  15 February 2011

S. Shimamura
S. Shimamura*
Affiliation:
Department of Applied Science, Faculty of Engineering, Yamaguchi University, Ube 755, Japan
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Abstract

The surfaces of various materials are often exposed to such environments as thermal cycling or irradiation. The failure processes caused by microcrackings in such an environment are studied by means of computer simulations. Crack growth is modeled as a series of processes of storage, release, and transfer of strain energies in the cubic lattice system. Surface crack pattern, crack penetration, and strain energy distribution are investigated for systems in different situations. The simulations reveal some correlations between crack pattern, crack penetration, and strain energy distribution. The results have some implications on the failure processes of materials in a thermal or radiational environment. The reliability of materials is discussed on the basis of the results of simulations.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 265: Symposium H – Materials Reliability in Microelectronics II , 1992 , 301
Copyright
Copyright © Materials Research Society 1992

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References

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