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Compliant Substrates for Reduction of Strain Relief in Mismatched Overlayers

Published online by Cambridge University Press:  10 February 2011

Carrie Carter-Coman ,
Robert Bicknell-Tassius ,
April S. Brown  and
Nan Marie Jokerst
Carrie Carter-Coman
Affiliation:
Georgia Institute of Technology, Electrical and Computer Engineering, Atlanta, GA 30332-0269.
Robert Bicknell-Tassius
Affiliation:
Was with Georgia Tech Research Institute, Atlanta, GA 30332.Now at Jet Propulsion Laboratory, M/S 302-306, 4800 Oak Grove Drive, Pasadena, CA 91109.
April S. Brown
Affiliation:
Georgia Institute of Technology, Electrical and Computer Engineering, Atlanta, GA 30332-0269.
Nan Marie Jokerst
Affiliation:
Georgia Institute of Technology, Electrical and Computer Engineering, Atlanta, GA 30332-0269.
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Abstract

Thin film compliant substrates can be used to extend the critical thickness in mismatched overlayers. A metastability model has been coupled with recent experimental strain relief data to determine the critical thickness of InGaAs epilayers grown on GaAs compliant substrates of variable thickness. The results of this model are also compared to other compliant substrate critical thickness models.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 441: Thin Films – Structure and Morphology , 1996 , 361
Copyright
Copyright © Materials Research Society 1997

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