Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-19T22:04:24.682Z Has data issue: false hasContentIssue false
  • English
  • Français

Commercial RTP-A SEMATECH Perspective

Published online by Cambridge University Press:  10 February 2011

Tony Speranza ,
Terry Riley ,
Arun Nanda ,
Burt Fowler ,
Kenneth Torres ,
Franz Geyling  and
Don Lindholm
Tony Speranza
Affiliation:
IBM Burlington, VT
Terry Riley
Affiliation:
AMD Austin, TX
Arun Nanda
Affiliation:
AT&T (Lucent) Orlando, FL
Burt Fowler
Affiliation:
Motorola Austin, TX
Kenneth Torres
Affiliation:
SEMATECH Austin, TX
Franz Geyling
Affiliation:
SEMATECH Austin, TX
Don Lindholm
Affiliation:
SEMATECH Austin, TX
Get access

Abstract

This paper discusses various commercial aspects of Rapid Thermal Processing (RTP). It provides an overview of SEMATECH's efforts to improve the manufacturing viability of RTP. Over the past several years SEMATECH, a U.S. Government/Industry consortium, has identified thermal equipment and processing needs relating to semiconductor manufacturing. It has aggressively pursued solutions to these needs through specific equipment projects. These projects include: RTP Installed Base Productivity Improvement, 0.25um RTP Tool Development, and RTP Modeling and Component Technology. Also discussed are several thermal projects which focus on the performance of more traditional tools. A comparison between RTP and a vertical furnace with model based process control and a small batch fast ramp furnace is made. A brief discussion of an RTP gate stack cluster tool project is followed by a review of future thermal processing needs, including 300mm.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 429: Symposium N – Rapid Thermal and Integrated Processing V , 1996 , 309
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. National Technology Roadmap for Semiconductors, SIA Semiconductor Association, 1994.Google Scholar
2. SEMATECH Tech Transfer Documents# 95032743A-ENG.Google Scholar
3. Nanda, A. K., Riley, T, Miner, G., Pas, M, Hossain-Pas, S. and Velo, L. This SymposiumGoogle Scholar
4. Riley, T., Nanda, A. K., Miner, G., Pas, M, Hossain-Pas, S. and Velo, L. This SymposiumGoogle Scholar
5. SEMATECH Tech Transfer Documents # 95072912A-XFR.Google Scholar
6. SEMATECH Tech Transfer Documents # 95052806A-XFR.Google Scholar
7. SEMATECH Tech Transfer Documents # 95022739A-ENG.Google Scholar
8. Jensen, K.F., Merchant, T.P., Cole, J.V., Hebb, J.P., Knutson, K.L. and Mihopoulos, T.G.; Modeling Strategies for Rapid Thermal Processing: 1995 NATO Advanced Summer Institute, “Advances in Rapid Thermal Processing”.Google Scholar
9. Cole, J.V. Knutson, K.L., Fiory, A.T. and Jensen, K.F.; Mote Carlo Simulation of Optical Temperature Sensors in RTP Systems: MRS Proc. on “Rapid Thermal and Integrated Processing IV”, Ed. Gelpey, J.C. et al; Vol.387, 1995.Google Scholar
10. Spence, P., Schaper, C. and Kermani, A.; Concurrent Design of an RTP Chamber and Advanced Control System: MRS Proc. on “Rapid Thermal and Integrated Processing IV”, Ed. Gelpey, J.C. et al; Vol.387, 1995.Google Scholar
11. Aling, H., Abebor, J., Ebert, J.L., Emami-Naini, A. and Kosut, R.L.; Application of Feedback Linearization to Models of RTP Reactors: Third International RTP Conference, RTP'95; Amsterdam.Google Scholar
12. Jensen, K.F., Simka, H., Mihopoulos, T.G., Futerko, P. and I-lierelmann, M.; Modeling Approaches for RTCVD: 1995 NATO Advanced Summer Institute, “Advances in Rapid Thermal Processing”.Google Scholar
13. Batram, M.E. and Moffat, H.K.; GCMS and FTIR Studies of By-Product Inhibited Growth and the Rate Limiting Step in TEOS-Based SiO+2 CVD: Proceedings from the 187th Meeting of the Electrochemical Society.Google Scholar
14. Barry, J., Geyling, F., Hill, R., Jasinski, T., Kersch, A. and Paranjpe, A.; Benchmarking Computational Fluid Dynamics (CFD) Codes for RTP Simulation: SEMATECH Tech Transfer Documents # 94012188A-ENG, 94012174A-XFR, 94012199A-XFR, 94032258AXFR, 94032259A-XFR, Latest Volume in Progress.Google Scholar
15. Vandenabeele, P., Maex, K. and De Keersmaecker, R.: ”Impact of Patterned Layers on Temperature Non-uniformity during RTP for VLSI Applications”; MRS Proc. on “Rapid Thermal Annealing/Chemical Vapor Deposition and Integrated Processing”, Ed.'s Hodul, D. et al; Vol.146, p. 149, 1989.Google Scholar
16. Doering, R., ”Single Wafer Processing: Opportunities and Challenges”, Proceedings of the International Electronics Manufacturing Technology Symposium, Austin, TX, October 2–4, 1995.Google Scholar
17. Doering, R., ”The MMST Program,” International Symposium on Semiconductor Manufacturing, September 20–21, 1993.Google Scholar
18. Green, M. L., Ma, Y., Brasen, D., and Sapjeta, B.J., “RTP'95,” 3rd International Rapid Thermal Processing Conference, August 30 - September 1, 1995.Google Scholar
19. Wood, S. C., Adaptable Manufacturing Systems for Semiconductor Integrated Circuit Production, Ph.D. Diss., Stanford University, May 1994.Google Scholar
20. SEMATECH Tech Transfer Documents # 95042805A-TR.Google Scholar
21. Griffiths, S.K., Nilson, R.H.; Thermal Gradients, Gravitational Stress and Plastic Deformation in Large Wafers, Sandia National Laboratories, Livermore California. Presented at 9/27/95 SEMATECH Conference on “Wafer Defect Science and Defect Engineering”.Google Scholar