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Chemical Metal Deposition on Insulators by An Ion-Beam Process

Published online by Cambridge University Press:  25 February 2011

Svend Stensig Eskildsen  and
Gunnar SØrensen
Svend Stensig Eskildsen
Affiliation:
Institute of Physics, University of Aarhus, DK-8000 Aarhus C, Denmark
Gunnar SØrensen
Affiliation:
Institute of Physics, University of Aarhus, DK-8000 Aarhus C, Denmark
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Abstract

An ion-induced decomposition of thin metal-compound films on insulating surfaces is described. 100-keV ion beams of Ar+, Kr+, and Xe+ was used to decompose thin (~10 nm) films of a palladium compound on polyimide and alumina. Changes in the stoichiometry have been observed with Rutherford Backscattering Spectrometry. The compound was also decomposed in a pattern using a mask, and the nondecomposed film could easily be removed with a suitable solvent. The decomposed palladium compound was used as a catalyst for a direct, electroless metal deposition of Cu. The plating speed was 30 nm/min, and a 4-5 µQcm copper film could be obtained after 3-4 min plating. Plated metal patterns are demonstrated on both polyimide and alumina, with a resolution in the µm range. On polyimide plating of a three-dimensional structure has been demonstrated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 45: Symposium A – Ion Beam Processes in Advanced Electronic Materials and Device Technology , 1985 , 253
Copyright
Copyright © Materials Research Society 1985

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References

REFERENCES

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