Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-29T07:46:31.505Z Has data issue: false hasContentIssue false

Characterization of Tilt Boundaries by Ultra High Resolution Electron Microscopy

Published online by Cambridge University Press:  25 February 2011

W. Krakow
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
J. T. Wetzel
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
D. A. Smith
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
G. Trafas
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
Get access

Abstract

A high resolution electron microscope study of grain boundary structures in Au thin films has been undertaken from both a theoretical and experimental point of view. The criteria necessary to interpret images of tilt boundaries at the atomic level, which include electron optical and specimen effects, have been considered for both 200kV and the newer 400kV medium voltage microscopes. So far, the theoretical work has concentrated on two different [001] tilt bounda-ries where a resolution of 2.03Å is required to visualize bulk lattice structures on either side of the interface. Both a high angle boundary, (210) σ=5, and a low angle boundary, (910) σ=41, have been considered. Computational results using multislice dynamical diffraction and image simulations of relaxed bounda-ries viewed edge-on and with small amounts of beam and/or specimen inclina-tion have been obtained. It will be shown that some structural information concerning grain boundary dislocations can be observed at 200kV. However, many difficulties occur in the exact identification of the interface structure viewed experimentally for both [001] and [011] boundaries since the resolution required is near the performance limit of a 200kV microscope. The simulated results at 400kV indicate a considerable improvement will be realized in obtain-ing atomic structure information at the interface.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Bourret, A. and Desseaux, J., Phil. Mag A 39, 405 (1979).10.1080/01418617908239281Google Scholar
2. Krivanek, O.L., Isoda, S. and Kobayashi, K., Phil. Mag. 36, 931 (1977).10.1080/14786437708239768Google Scholar
3. Krakow, W., Thin Sol. Films, 93, 109 (1982).10.1016/0040-6090(82)90096-7Google Scholar
4. Penisson, J.M., Gronsky, R. and Brosse, J.B., scripta Met.. 16, 1239 (1982).10.1016/0036-9748(82)90474-4Google Scholar
5. Ichinose, H. and Ishida, Y., Phil. Mag., 43, 1253 (1981).10.1080/01418618108236154Google Scholar
6. Ishida, Y., Ichinose, H., Mori, M. and Hashimoto, M., Trans. Jpn. Inst. of Met. 24 349 (1983).10.2320/matertrans1960.24.349Google Scholar
7. Goodhew, P.J., Tan, T.Y. and Balluffi, R.W., Acta Met., 26, 557 (1978).10.1016/0001-6160(78)90108-6Google Scholar
8. Wetzel, J.T. and Machlin, E.S., Sur. Sci., 144, 124 (1984).10.1016/0039-6028(84)90711-8Google Scholar
9. Krakow, W., IBM J. Res. and Devel., 25, 58 (1981).10.1147/rd.251.0058Google Scholar
10. Scholz, R., private communication.Google Scholar