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Characterization of Polysiloxane Modified Polysilsesquioxane Films for Low Dielectric Applications: Microstructure, Electrical Properties and Mechanical Properties

Published online by Cambridge University Press:  01 February 2011

Jingyu Hyeon-Lee ,
Yi Yeol Lyu ,
Sang Kook Mah ,
Jin-Hyeong Yim ,
Hyun-Dam Jeong ,
Mong Sup Lee  and
Sang Youl Kim
Jingyu Hyeon-Lee
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Yi Yeol Lyu
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Sang Kook Mah
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Jin-Hyeong Yim
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Hyun-Dam Jeong
Affiliation:
E-Polymer Laboratory, Samsung Advanced Institute of Technology, Suwon, 440-600, Korea
Mong Sup Lee
Affiliation:
Dept of Chemistry, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea
Sang Youl Kim
Affiliation:
Dept of Chemistry, Korea Advanced Institute of Science and Technology, Taejon, 305-701, Korea
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Abstract

Poly(ε-caprolactone) (PCL) / poly(siloxane-silsesquioxane) (PSQ-PSSQ) nanohybrid films were fabricated. The dielectric constant of the film was scaled down from 2.66 to 2.28 when the 30% PCL was added into poly(siloxane-silsesquioxane) matrix. The FE-SEM micrograph of poly(ε-caprolactone) / poly(siloxane-silsesquioxane) (PSQ-PSSQ) nanohybrid film shows nanoporous structure. The modulus and hardness of the film decrease with increasing film thickness. As PCL content increases, modulus and hardness of the films decreases.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 716: Symposium B – Silicon Materials-Processing, Characterization, and Reliability , 2002 , B7.15
Copyright
Copyright © Materials Research Society 2002

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