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Published online by Cambridge University Press: 01 February 2011
Low duty cycle, high peak power, conductively cooled laser diode arrays have been manufactured for several years by a number of different vendors. Typically these packages have been limited to a few percent duty cycles due to thermal problems that develop in tight bar pitch arrays at higher duty cycles. Traditionally these packages are made from some combination of copper and BeO or Tungsten/copper and BeO. Trade-offs between thermal conductivity and CTE matching are always made when manufacturing these devices. In addition, the manufacturability of the heat sinks plays a critical role in creating a cost effective, high performance solution. In this discussion we examine several different exotic materials that have been manufactured and tested as heat sinks for laser diode arrays.