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Channeling Contrast Microscopy: A Powerful Tool for Examining Semiconductor Structures
Published online by Cambridge University Press: 25 February 2011
Abstract
Channeling contrast microscopy with a He+ microbeam has been employed to measure 3-dimensional damage distributions and impurity profiles in ion implanted laser annealed silicon. Refinements to the technique are described, involving construction of a precision goniometer to allow accurate orientation of the microbeam with respect to micron-scale- sample features. We have found that indium diffusion in amorphous silicon is significantly less for laser annealing than with lower temperature furnace annealing. Lateral variations in the extent of crystal growth have also been observed across laser irradiated areas less than 100μm.
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