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Ceramic Substrates - Micro Circuits, a Partnership in Growth

Published online by Cambridge University Press:  22 February 2011

William M. Flock
William M. Flock*
Affiliation:
Coors Porcelain Company, 600 9th St., Golden, Colorado 80401
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Abstract

An increased understanding and utilization of suhstrate properties will he required to improve future performance and reliability of microelectronic devices. Previously, only the passive substrate/package properties were required for micro devices. Newer designs are utilizing both the active and passive properties of the ceramic materials. These new demands are being driven by end user circuit needs, and will generate major changes in the processing and fabrication of oxide materials.

The status of oxide raw material availability, and the characterization of these materials is reviewed. The processing, and fabrication of substrate materials and the interactions with end use properties are discussed. The future expectations and demand on the materials and processes are forecasted. Substrate properties and their impact on final circuit performance are emphasized.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 7
Copyright
Copyright © Materials Research Society 1985

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References

1 Schwartz, R., “Microelectronics Packaging: 11,” Journal American Ceramic Society, 63 [4] 577–581 (1984).Google Scholar
2 Riemer, D., “The Effect of Thick-Film Materials on Suhstrate Breakage During Processing”, Journal Hybrid Microelectronics, 6 599–604 (1983).Google Scholar
3 Seraphim, D.P. and Feinherg, I., “Electronic Packaging Evolution in IBM”, The IBM Journal of Research and Development, 25 617–629 (1981).CrossRefGoogle Scholar
4 Flock, W.M., “Characterization and Process Interactions”, Ceramic Processing Refore Firing, Edited by Onoda, G.Y. Jr. and Hench, L.L., John Wiley & Sons, New York, N.Y., pp 31–34 (1978).Google Scholar
5 Flock, W.M., “Rayer-Processed Aluminas”, Ceramic Processing Before Firing, Edited by Onoda, G.Y. Jr. and Hench, L.L., John Wiley & Sons, New York, N.Y., pp 85–100 (1978).Google Scholar
6 Dol, Takao and Namura, Satoshi, U.S. Pat. 4,277,528 (1981).Google Scholar
7 Stevens, R., “An Introduction to Zirconia”, Magnesium Electron Pub. 113, (1983).CrossRefGoogle Scholar
8 Garvie, R.C., Hannink, R.H., and Pascoe, R.J., Nature, 258–703 (1975).CrossRefGoogle Scholar
9 Osborn, E.F., and Others, “Optimum Composition of Blast-Furnace Slag as Deduced from Liquidus Data for the Quaternary System CaO-MgO-Al2O3-SiO2 , Journal Metals 6, 33–45 (1954).Google Scholar
10 Flock, W.M., U.S. Pat. 3,615,763 (1971).Google Scholar
11 Hoffman, H.S., “Post Evaporation Annealing of Cr-Cu-Cr Metallized Ceramics”, Proceedings 26th Electronic Components Conference, 173–176 (1976).Google Scholar
12 Class, W.H., “Thin Film Circuit Processing on Dielectric Substrates”, Journal Solid State Technologies, August 32–36 (1974).Google Scholar
13 Cummings, J.P. and Weinman, L.S., “Preparation and Characterization of Patterned Cr-Cu Films Deposited on Alumina”, Proceeding International Microelectronics Symposium (1980).Google Scholar
14 Couzelis, J.M., Mason, J.W. and McDade, J.C., “Hybrid Circuits: An Integral Part of The Systems Packaging Concept”, Electronic Packaging and Production 97–107 January (1982).Google Scholar
15 Snook, J.R., “As-Fired vs. Lapped/Polished Substrates For Thick and Thin Film Hybrid Circuits: A Survey of Relative Advantages”, Accumet Engineering Corporation, Hudson, MA.Google Scholar
16 Goldberg, N., “Design of Thin Film Multi-Chip Modules”, Sperry Univac International Publishers, St. Paul, Minn.Google Scholar
17 Harper, C.A., “Substrates for Microelectronics”, Electronic Packaging and Production 270–275 July (1974).Google Scholar