Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-26T21:52:13.139Z Has data issue: false hasContentIssue false
  • English
  • Français

Carrier-Level Packaging and Reliability of a MEMS-Based Safety and Arming Device

Published online by Cambridge University Press:  21 March 2011

Michael Deeds ,
Kevin Cochran ,
Rajesh Swaminathan  and
Peter Sandborn
Michael Deeds
Affiliation:
[email protected], (Indian Head Naval Surface Warfare Center)
Kevin Cochran
Affiliation:
(Indian Head Naval Surface Warfare Center)
Rajesh Swaminathan
Affiliation:
(University of Maryland, CALCE)
Peter Sandborn
Affiliation:
(University of Maryland, CALCE)
Get access

Abstract

Packaging of MEMS devices introduces new challenges to the package architecture. MEMS systems include interfaces, processes, and materials foreign to the IC packaging industry. To build reliable MEMS systems, failure modes must be identified and understood. In addition, measurement techniques must be developed to interrogate critical aspects of the package.

The present work addresses the architecture of the carrier-level packaging for a MEMS-based Safety and Arming device (S&A). The impact of moisture on packaged MEMS systems and test structures are investigated through an environmental conditioning program that includes thermal cycling and accelerated aging. MEMS switches are packaged in hermetic, non-hermetic, and ventilated configurations to facilitate in-situ monitoring of device health. A MEMS humidity sensor is included in these packages to allow interrogation of package environment characteristics.

Mechanical MEMS test structures are put through the same environmental conditions as the MEMS switches. These structures provide additional data on the failure modes of the packaged switches. Push test structures provide cumulative data on friction, stiction, and material properties and dog bone structures isolate material property influences.

Keywords

MEMSpackagingreliabilityLIGADRIEsurface micromachiningbulk micromachiningenvironmental testinghermeticS&A
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N4.4
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Last, H., Deeds, M., Garvick, D., Kavetsky, R., Sandborn, P. Magrab, E. B., and Gupta, S. K., IEEE Transactions on Components and Packaging Technologies, 22, 338–343 (1999).Google Scholar
2. Fan, L., Last, H., Wood, R., Dudley, B., Malek, C. K., and Ling, Z., Microsystem Technologies, 4, 168–171 (1998).Google Scholar
3. Madou, M. J., Fundamentals of Microfabrication, CRC Press (1997).Google Scholar
4. Sandborn, P., Swaminathan, R., Subramanian, G., Deeds, M., and Cochran, K., Proc. Inter Society Conference on Thermal Phenomena (ITHERM), 133–140 (2000).Google Scholar
5. Beamesderfer, M., DeVoe, D., Litcher, E., and Johnson, K., Proc. SPIE Symposium on Micromachining and Microfabrication, 101–111 (1999).Google Scholar
6. Babcock, W, Last, H., Vaughan, C., SEM, to be published (2001).Google Scholar
7. Hemker, K. J., Last, H., MRS Symposium. Proc 518, 185–190 (1998).Google Scholar