Hostname: page-component-cd9895bd7-8ctnn Total loading time: 0 Render date: 2024-12-27T01:53:56.795Z Has data issue: false hasContentIssue false
  • English
  • Français

The Behavior of Copper Nanoparticle Chain Aggregates Under Strain – A Molecular Dynamics Approach

Published online by Cambridge University Press:  10 February 2011

Adamos S. Dalis  and
Sheldon K. Friedlander
Adamos S. Dalis
Affiliation:
Department of Chemical Engineering, University of Californiain Los Angeles, Los Angeles, CA 90095-1592
Sheldon K. Friedlander
Affiliation:
Department of Chemical Engineering, University of Californiain Los Angeles, Los Angeles, CA 90095-1592
Get access

Abstract

Nanoparticle chain aggregates (NCA) serve as reinforcing fillers that are combined with molecular polymers to produce nano-composite materials, e.g. carbon black in rubber. The reinforcing mechanism due to the incorporation of nanoparticle aggregates is not well understood. Molecular dynamics (MD) computer simulations are employed to investigate the behavior of nanoparticle chain aggregates under strain. The interaction potential used is that of Cu obtained with the embedded atom method (EAM). Three single-crystal Cu nanoparticles are placed in contact in two different configurations (linear and kinked) and the structures are initially relaxed with MD steps for 300 ps. We observe plastic deformation during the sintering process for very small particles (∼2.5 nm in diameter) at temperatures as low as 300 K. The relaxed configurations are then strained to the breaking point at strain rates in the order of 1 m/s. We identify mechanisms of strain accommodation that lead to nanoparticle plastic deformation and eventually fracture. The linear and the kinked configurations break at strains of 0.263 and 0.344 respectively, while the maximum stress is close to 4 GPa (strain rate: 0.625 m/s). Both structures fail at the low-angle grain boundaries developed during the sintering process, while the higher strain for fracture for the kinked configuration is associated with interface sliding not observed in the linear case.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 778: Symposium U – Mechanical Properties Derived from Nanostructuring Materials , 2003 , U9.8
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Heinrich, G., Klüppel, M. and Viglis, T. A., Curr. Opin. Solid St. M. 6, 195 (2002).Google Scholar
[2] Mark, J. E., J. Phys. Chem. B 107, 903 (2003).Google Scholar
[3] Medalia, A. I. and Kraus, G. in Science and Technology of Rubber 2nd ed., edited by Mark, J. E., Erman, B. and Eirich, F. R., (Academic Press, 1994) pp. 387–418.Google Scholar
[4] Pu, Z., Mark, J. E., Jethmalani, J. M. andFord, W. T., Chem. Mater. 9, 2442 (1997).Google Scholar
[5] Kohls, D. J., Beaucage, G., Curr. Opin. Solid St. M. 6, 183 (2002).Google Scholar
[6] Gerspacher, M., O'Farrell, C. P., Kaut. Gummi Kunstst. 54, 153 (2001).Google Scholar
[7] Witten, T. A., Rubinstein, M. and Colby, R. H., J. Phys. II France 3, 367 (1993).Google Scholar
[8] Friedlander, S. K., Jang, H.D.,Ryu, K. H., Appl. Phys. Lett. 72, 173 (1998).Google Scholar
[9] Ogawa, K., Vogt, T., Ullmann, M., Johnson, S. and Friedlander, S. K., J. Appl. Phys. 87, 63 (2000).Google Scholar
[10] Suh, Y. J. and Friedlander, S. K., J. Appl. Phys. 93, 3515 (2003).Google Scholar
[11] Friedlander, S. K., Ogawa, K., Ullmann, M., J. Polym. Sci. Pol. Phys. 38, 2658 (2000).Google Scholar
[12] Foiles, S.M., Baskes, M. I. andDaw, M. S., Phys. Rev. B 33, 7983 (1986).Google Scholar
[13] The EAM parameterization used was that of Oh, D. J. and Johnson, R. A., J. Mater. Res. 3, 471 (1988).Google Scholar
[14] Landman, U., Luedtke, W. D., Burnham, N. A., Colton, R. J., Science 248, 454 (1990).Google Scholar
[15] Zhu, H. and Averback, R. S., Phil. Mag. Lett. 73, 27 (1996).Google Scholar
[16] Zeng, P., Zalac, S., Clapp, P. C., Rifkin, J.A., Mater. Sci. Eng. A 252, 301 (1998).Google Scholar