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Application of Superplasticity in Solder Joints
Published online by Cambridge University Press: 25 February 2011
Abstract
The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strain range. Similarly, compliant J Bend and Gull wing joints, which last thousands of cycles, operate at lower stresses where superplastic deformation predominates.
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- Copyright © Materials Research Society 1991