Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-29T09:06:11.694Z Has data issue: false hasContentIssue false

Application of Photoacoustic Spectroscopy to Porous Silicon

Published online by Cambridge University Press:  10 February 2011

Masato Ohmukai
Affiliation:
Department of Electrical Engineering, Akashi College of Technology, Hyogo 674-8501, Japan, [email protected]
Akiharu Kobayashi
Affiliation:
Department of Electrical Engineering, Akashi College of Technology, Hyogo 674-8501, Japan, [email protected]
Nobutomo Uehara
Affiliation:
Department of Electrical Engineering, Akashi College of Technology, Hyogo 674-8501, Japan, [email protected]
Tetsuya Yamazaki
Affiliation:
Department of Electrical Engineering, Akashi College of Technology, Hyogo 674-8501, Japan, [email protected]
Shinji Fujihara
Affiliation:
Department of Electrical Engineering, Akashi College of Technology, Hyogo 674-8501, Japan, [email protected]
Yasuo Tsutsumi
Affiliation:
Department of Electrical Engineering, Akashi College of Technology, Hyogo 674-8501, Japan, [email protected]
Get access

Abstract

We are investigating applicability of photoacoustic (PA) spectroscopy to porous silicon. Since PA spectroscopy is based on a non-radiative relaxation process, the measurement is of importance as a counterpart to photoluminescent spectroscopy. We studied a dependence of a PA amplitude on a chopping frequency and discussed the influence of a PA signal originated in a silicon substrate. The frequency dependence was elucidated with a two-layer model. Differences in PA spectra are correlated with a photoluminescent efficiency. From the correlation, we believe that non-radiative centers quench the efficiency.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Canham, L. T., Appl. Phys. Lett. 57, 1046 (1990).Google Scholar
2. Ueno, T., IEEE Electron Device Lett. 12, 691 (1991).Google Scholar
3. Koshida, N. and Koyama, H., Appl. Phys. Lett. 60, 347 (1992).Google Scholar
4. Takagahara, T. and Takeda, K., Phys. Rev. B 46, 15578 (1992).Google Scholar
5. Roy, A., Chainani, A., Sarma, D. D., and Sood, A. K., Appl. Phys. Lett. 61, 1655 (1992).Google Scholar
6. Prokes, S. M., J. Appl. Phys. 73, 407 (1993).Google Scholar
7. Kanemitsu, Y., Phys. Rev. B 49, 16845 (1994).Google Scholar
8. Ohmukai, M. and Tsutsumi, Y., J. Appl. Phys. 84, 4459 (1998).Google Scholar
9. Ohmukai, M. and Tsutsumi, Y., Thin Solid Films 302, 51 (1997).Google Scholar
10. Rosencwaig, R. and Gersho, A., J. Appl. Phys. 47, 64 (1976).Google Scholar
11. Koch, F., Petrove-Koch, V., Muschik, T., Nikolov, A. and Gavrilenko, V., Mat. Res. Soc. Symp. 283, 197 (1993).Google Scholar
12. Adams, M. J. and Kirkbright, G. F., Analyst, 102, 678 (1977).Google Scholar