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Application of Magnetic Ferrite Electrodeposition and Copper Chemical Mechanical Planarization for On-Chip Analog Circuitry

Published online by Cambridge University Press:  01 February 2011

Cody Washburn ,
Daniel Brown ,
Jay Cabacungan ,
Jayanti Venkataraman  and
Santosh K. Kurinec
Cody Washburn
Affiliation:
Microelectronic Engineering
Daniel Brown
Affiliation:
Electrical Engineering Rochester Institute of Technology, Rochester, NY 14623
Jay Cabacungan
Affiliation:
Microelectronic Engineering
Jayanti Venkataraman
Affiliation:
Electrical Engineering Rochester Institute of Technology, Rochester, NY 14623
Santosh K. Kurinec
Affiliation:
Microelectronic Engineering
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Abstract

Inductors are important components of analog circuit designs, from matching circuitry to passive filters. In this study, the application of electrophoretically deposited nano-ferrite material has been investigated as a technique to increase the inductance of integrated copper planar inductors fabricated using copper plating and chemical mechanical planarization. Sintered Mn-Zn ferrite particles are suspended in a medium of isopropyl alcohol with magnesium nitrate and lanthanum nitrate salts. The transportation of the particles to the substrate surface is assisted by applied electric field and particles adhere to the substrate surface by a glycerol based surfactant. Electrophorectic deposition process forms a self aligned polymeric thin film on the surface of a p-type silicon substrate selectively with respect to copper. This ferrite deposition method yields high selectivity to the inductor coils and patterned silicon substrates compatible with standard silicon technology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 869: Symposium D – Materials, Integration and Technology for Monolithic Instruments , 2005 , D2.3
Copyright
Copyright © Materials Research Society 2005

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