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Annealing Effects of Schottky Contacts on the Characteristics of 4H-SiC Schottky Barrier Diodes

Published online by Cambridge University Press:  10 February 2011

S. C. Kang
Affiliation:
Department of Ceramic Materials Engineering, Myong Ji University 38–2 Nam-Dong, Yongin-Si, Kyunggi-Do, Korea 449–728, Phone: 82–335–330–646582–335–33–6457
B. H. Kum
Affiliation:
Department of Ceramic Materials Engineering, Myong Ji University 38–2 Nam-Dong, Yongin-Si, Kyunggi-Do, Korea 449–728, Phone: 82–335–330–646582–335–33–6457
S. J. Do
Affiliation:
Department of Materials Science and Engineering, Pohang Institute of Science and TehnologyP 0. BOX 125, POHANG 790–600, Korea, Tel: 82–562–79–2139, 82–562–79–2399
J. H. Je
Affiliation:
Department of Materials Science and Engineering, Pohang Institute of Science and TehnologyP 0. BOX 125, POHANG 790–600, Korea, Tel: 82–562–79–2139, 82–562–79–2399
M. W. SHIN
Affiliation:
Department of Ceramic Materials Engineering, Myong Ji University 38–2 Nam-Dong, Yongin-Si, Kyunggi-Do, Korea 449–728, Phone: 82–335–330–646582–335–33–6457
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Abstract

This paper reports on the relationship between the microstructure and the device performance of Pt/4H-SiC schottky barrier diodes ( SBDs ). The evolution of microstructure in the metal/SiC interfaces annealed at different temperatures was characterized using X-ray scattering techniques. The reverse characteristics of the devices were degraded with annealing temperatures. The maximum breakdown voltages of as-deposited devices and 850 °C annealed devices are 1300 V and 626 V, respectively. However, the forward characteristics of the devices were found out to improve with annealing temperatures. X-ray scattering analysis showed that Pt-silicides were formed by annealing performed at or higher than 650 °C. The formation of silicides was shown to increase the roughness of the Pt/SiC interface. It is believed that the forward characteristics of the SBDs be strongly dependent on the crystallity of silicides formed in the Pt/SiC interface during the annealing process.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

1. Weitzel, Charles E., Palmour, John W., Carter, Calvin H. Jr, Moore, Karen, Nordquist, Kevin J., Scott Allen, Christine Thero, and Mohtt Bhatnagar, IEEE transactions on Electron Devices 41(10), 17321741, (1996)10.1109/16.536819Google Scholar
2. Lauermann, Iver, Memming, Rudiger, and Meissner, Dieter, J. Electronchem. Soc., 144(1), p.7380. (1997)10.1149/1.1837367Google Scholar
3. Itoh, A., Kimoto, T., and Matsunami, H.., Member, IEEE, IEEE Electron Device letters, 16(6), p. 280282. (1995)10.1109/55.790735Google Scholar
4. Alok, Dev. and Baliga, B.J., Proceeding of 1995 International Symposium on Power Semiconductor Devices & Ics, p. 96100, (1995)Google Scholar
5. Crofton, J., Luckowski, E. D., et al, Inst. Phys. Conf Ser. No. 142: Chapter 3, Paper presented at Silicon Carbide and Related Materials 1995 Conf. Kyoto, Japan, (1995)Google Scholar
6. Porter, L.M., Davis, R.E, Bow, J.S., Kim, M.J., and Carpenter, R.W., Inst. Phys. Conf. Ser No 137, p. 581584, (1993)Google Scholar
7. Papanicolaou, N. A., Christou, A., and Gipe, M. L., J. Appl. phys. 65(9), p. 35263530, (1989)10.1063/1.342626Google Scholar