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Analysis of Thermal Stress Induced Void Growth During Thermal Cycling

Published online by Cambridge University Press:  21 February 2011

D.D. Brown ,
M.A. Korhonen ,
P. Børgesen  and
C.-Y. Li
D.D. Brown
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
M.A. Korhonen
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
P. Børgesen
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
C.-Y. Li
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
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Abstract

Recent work in thermal stress induced voiding in passivated lines has focussed on the isothermal, quasi-steady state growth of existing voids. In this work, the transient growth and shrinkage of voids during the thermal cycling of narrow, passivated lines was studied. Analysis of experimental data for passivated lines demonstrates the quick buildup and evolution of a backstress at the grain boundary during heating and cooling. This backstress greatly reduces the driving force for void growth at higher temperatures and must be accounted for in stress induced void growth models for the case of appreciably varying temperatures in short time scales.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 223
Copyright
Copyright © Materials Research Society 1993

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