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An Overview of Materials Science in Printed Circuit Packaging

Published online by Cambridge University Press:  22 February 2011

D. P. Seraphim ,
L. C. Lee ,
B. K. Appelt  and
L. L. Marsh
D. P. Seraphim
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
L. C. Lee
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
B. K. Appelt
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
L. L. Marsh
Affiliation:
IBM Corporation, Systems Technology Division, Endicott, New York 13760
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Abstract

A brief description of a set of processes and materials to make printed circuit panels will be given. Then we will discuss the multi-disciplines required for forming a scientific base and provide examples where the fundamentalist and often times specialist is providing the scientific data needed by the packaging engineer. Control techniques, characterization or otherwise basic information helpful in decision making is provided to the development and production groups. Specifically, the state of resin cure at critical steps in the process is used to demonstrate the inter-relation between cure, flow, and mechanical properties in affecting printed circuit board integrity. Finally, the complex role of moisture solubility and diffusion from the process environment in perturbing the chemical and mechanical state is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 21
Copyright
Copyright © Materials Research Society 1985

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References

1. Colucci, M. J., Thesis submitted to U. of Texas, December 1983, “Void Formation in Glass Reinforced Epoxy Resin Prepregs.”Google Scholar
2. Springer, G. S. and Shen, Chi-Haung, Moisture Absorption and Desorption of Composite Materials, Journal of Composite Materials, Vol.10, No. 2, 1976.Google Scholar
3. Flory, P. T., Principles of Physical Chemistry, Cornell University Press, 1953.Google Scholar
4. Lahti, J. N., Delaney, R. H. and Hines, J. N., “Characteristic Wear-Out Process in Epoxy-Glass PCB for High Density Electronic Packaging,” Proc Technical Program, I. Rel Physics Symposium, 1977.Google Scholar
5. Marsh, L. L., Lasky, R. J., Seraphim, D. P., and Springer, G. S., “Moisture Solubility and Diffusion in Epoxy and Epoxy-Glass Composites,” IBM J. Res Development, 28 (655–661) 1984.CrossRefGoogle Scholar
6. Marsh, L. L., Van Hart, D. K., and Kotkiewicz, S. M., “Moisture Behaviorin Epoxy-Glass Coupons and Circuit Boards as Viewed by Dielectric Loss,” IBM J. Res Develop, Vol 29, 1985.Google Scholar
7. Berry, B. S., Private Communication of Data to be published.Google Scholar
8. Nellig, J. M., Saxtion, R. W., and Hewitt, W. R., “Micro Drill Technology Update,” PC Fabrication, March 1984.Google Scholar
9. Weiss, R. E., “The Effect of Drilling Temperature on Multilayer Board Hole Quality,” Circuit World, Vol.7, No. 3, 1977.Google Scholar
10. Tsai, S. W. and Hahn, H. T., “Introduction to Composite Materials,” Technomic Publishing Co., 1980.Google Scholar