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An Investigation of Au-Ag Interface Formed by Cold Welding Using Focused Ion Beam/Transmission Electron Microscopy

Published online by Cambridge University Press:  26 February 2011

Yifang Cao ,
Nan Yao ,
Kevin McIlwrath ,
Jikou Zhou ,
Gabriel Osinkolu  and
Winston O. Soboyejo
Yifang Cao
Affiliation:
[email protected], Princeton University, Department of Mechanical and Aerospace Engineering, 1 Olden Street, Princeton, NJ, 08544, United States
Nan Yao
Affiliation:
[email protected], Princeton University, Princeton Institute for the Science and Technology of Materials (PRISM), Princeton, NJ, 08544, United States
Kevin McIlwrath
Affiliation:
[email protected], Hitachi High Technologies America, Pleasanton, CA, 94588, United States
Jikou Zhou
Affiliation:
[email protected], Princeton University, Princeton Institute for the Science and Technology of Materials (PRISM), Princeton, NJ, 08544, United States
Gabriel Osinkolu
Affiliation:
[email protected], Obafemi Awolowo University, Center for Energy Research and Development, Ile-Ifa, N/A, Nigeria
Winston O. Soboyejo
Affiliation:
[email protected], Princeton University, Princeton Institute for the Science and Technology of Materials (PRISM), Princeton, NJ, 08544, United States
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Abstract

This paper reports the recent results of a transmission electron microscopy study of cold-welded and e-beam deposited Au-Ag interfaces. Dust particles were observed to be embedded between the cold-welded interfaces. These are shown to amplify the defect regions caused by surface asperities. Electron energy loss spectroscopy (EELS) analysis revealed that there was no significant diffusion zone across the cold welding interface. However, sub-micron mechanical twining structures were revealed by transmission electron microscopy (TEM) analyses. These were found to penetrate through both the cold-welded and control Au-Ag interfaces, but with different orientations.

Keywords

AgAutransmission electron microscopy (TEM)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 965: Symposium S – Organic Electronics – Materials, Devices and Applications , 2006 , 0965-S12-06
Copyright
Copyright © Materials Research Society 2007

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References

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